Loading...

LPC1113FHN33/201,5

NXP Semiconductors

LPC1113FHN33/201,5 by NXP Semiconductors

LPC1113FHN33/201,5 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$2.434

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.147

10k+ parts

-

9,880

-

-

$2.147

-

Flip Electronics (Authorized)

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,940

-

-

-

-

DigiKey

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.720

10k+ parts

-

780

-

-

$2.720

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,468

-

-

-

-

Flip Electronics

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,940

-

-

-

-

Digiode

USA . 3,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,047

-

-

-

-

Anansix

USA . 1,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,026

-

-

-

-

R&J Components

USA . 418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

418

-

-

-

-

Schukat

Germany . 320 parts In-Stock

1+ parts

-

100+ parts

$1.960

1k+ parts

-

10k+ parts

-

320

-

$1.960

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,312 parts In-Stock

1+ parts

$18.183

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$18.183

-

-

-

Andel Nordic

Denmark . 20 parts In-Stock

1+ parts

$46.540

100+ parts

-

1k+ parts

$32.579

10k+ parts

$32.579

20

$46.540

-

$32.579

$32.579

UNI Independent Distributors

Spain . 4,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,197

-

-

-

-

Corphita

USA . 3,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,665

-

-

-

-

Overview

Unlock your project’s potential with the LPC1113FHN33/201,5 microcontroller by NXP Semiconductors—a beacon of quality and reliability in embedded systems. Engineered for versatility, this 32-bit powerhouse excels in low-power applications, providing robust performance across industrial environments. Enjoy seamless integration with I2C, SPI, and UART connectivity, while benefitting from its compact design and enhanced features that drive innovation and efficiency effortlessly. Elevate your designs with NXP's trusted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection for the microcontroller in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into small devices.

Maximum Supply Voltage: 3.6 V

Supporting a maximum supply voltage of 3.6 V enables efficient power management for battery-operated applications.

Package Shape: SQUARE

The square package shape provides stability and uniformity in PCB design, making it easier to layout the circuit.

Bit Size: 32

A 32-bit architecture increases the processing capability, allowing for more complex calculations and data handling.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3 V strikes a good balance between power consumption and performance.

No. of Terminals: 33

With 33 terminals, this microcontroller offers multiple I/O options for versatile interfacing in various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style supports heat dissipation while maintaining a low profile for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage of 1.8 V allows for operation in low-power scenarios, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

An operational range up to 85 °C makes it suitable for industrial environments where temperature fluctuations can occur.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is energy-efficient, offering a good performance-to-power ratio for embedded applications.

Minimum Operating Temperature: -40 °C

Capable of functioning at -40 °C ensures reliability in extreme cold environments, crucial for automotive and outdoor applications.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog sensors, enhancing the functionality of the microcontroller.

Terminal Position: QUAD

Quad terminal positioning facilitates better layout flexibility and ease of soldering on PCB designs.

ROM Words: 24576

A substantial ROM capacity of 24576 words provides ample space for application code and firmware, allowing for complex programs.

Width: 7 mm

A compact width of 7 mm aids in designing miniaturized electronic devices without sacrificing functionality.

Peripherals: BOD, POR, TIMER(5), WDT

A comprehensive range of peripherals enhances functionality, enabling smart event handling and power management.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz allows for efficient and fast processing of tasks.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with standard soldering processes, ensuring reliable assembly.

Length: 7 mm

A small length of 7 mm is ideal for compact electronic designs, fitting easily into tight spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures it's designed for use in harsh environments, ensuring longevity and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for faster instruction execution, enhancing the overall performance of the microcontroller.

RAM Bytes: 4096

With 4096 bytes of RAM, it allows for effective data handling and processing during program execution.

Technology: CMOS

Built on CMOS technology, it provides low power consumption, essential for portable devices.

Terminal Form: NO LEAD

No lead terminal form is beneficial for modern environmentally friendly soldering processes.

Analog To Digital Converters: 8-Ch 10-Bit

8-channel 10-bit ADCs enable precise analog signal processing, essential for sensor integration.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V ensures compatibility with many other devices and simplifies design.

Connectivity: I2C, SPI, UART

Versatile connectivity options such as I2C, SPI, and UART support various communication protocols for easy interfacing.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing the device's lifetime.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for high-density PCB designs, accommodating more components in limited spaces.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, making it suitable for various standard manufacturing processes.

Speed: 50 rpm

A speed of 50 rpm is sufficient for a range of applications, providing flexibility in performance requirements.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient data storage and retrieval, optimizing performance.

No. of I/O Lines: 28

With 28 I/O lines, this microcontroller provides versatile routing for input and output operations, supporting complex applications.

Technical Specifications

Microcontrollers LPC1113FHN33/201,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FHN33/201,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20