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LPC1113FBD48/301,1

NXP Semiconductors

LPC1113FBD48/301,1 by NXP Semiconductors

NXP Semiconductors' LPC1113FBD48/301,1 is a 32-bit microcontroller with 48 terminals and 3.3V supply voltage. Featuring a Cortex-M0 CPU, it operates b/w -40 to 85°C and offers 8-Ch 10-Bit ADC channels. Ideal for industrial applications requiring I2C, SPI, UART connectivity and on-chip FLASH ROM programmability at up to 25 MHz clock frequency.

Median Price

$3.702

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 146 parts In-Stock

1+ parts

$4.600

100+ parts

$2.908

1k+ parts

$2.602

10k+ parts

$2.525

146

$4.600

$2.908

$2.602

$2.525

Mouser Electronics

USA . 69 parts In-Stock

1+ parts

$6.180

100+ parts

$3.480

1k+ parts

$2.720

10k+ parts

$2.650

69

$6.180

$3.480

$2.720

$2.650

RS (Exports)

UK . 347 parts In-Stock

1+ parts

-

100+ parts

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$3.702

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347

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$3.702

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Future Electronics

Canada . 250 parts In-Stock

1+ parts

-

100+ parts

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$2.050

10k+ parts

$2.030

250

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-

$2.050

$2.030

Rochester

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$2.430

1k+ parts

$2.180

10k+ parts

$2.050

39

-

$2.430

$2.180

$2.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,983 parts In-Stock

1+ parts

$2.118

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3,983

$2.118

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Vyrian

USA . 8,150 parts In-Stock

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8,150

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NAC Semi

USA . 500 parts In-Stock

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$3.220

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500

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$3.220

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Schukat

Germany . 350 parts In-Stock

1+ parts

-

100+ parts

$2.651

1k+ parts

$2.554

10k+ parts

-

350

-

$2.651

$2.554

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IBS Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.665

10k+ parts

$2.639

250

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-

$2.665

$2.639

Flip Electronics

USA . 235 parts In-Stock

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235

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Anansix

USA . 88 parts In-Stock

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88

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Distributors (Availability)

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Corphita

USA . 4,953 parts In-Stock

1+ parts

$2.007

100+ parts

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4,953

$2.007

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Vigor

Singapore . 9 parts In-Stock

1+ parts

$4.050

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9

$4.050

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Microchip USA

USA . 9,250 parts In-Stock

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$14.392

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9,250

$14.392

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$43.546

100+ parts

$39.627

1k+ parts

$35.708

10k+ parts

-

2,000

$43.546

$39.627

$35.708

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UNI Independent Distributors

Spain . 7,689 parts In-Stock

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7,689

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 1,680 parts In-Stock

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1,680

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Overview

Experience seamless performance and reliability with the LPC1113FBD48/301,1 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors guarantees top-notch quality and cutting-edge technology in their microcontrollers. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for efficient and versatile solutions. Trust in NXP Semiconductors to deliver superior performance and innovation with the LPC1113FBD48/301,1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for different applications.

Package Shape: SQUARE

Space-efficient design that can fit compactly into electronic devices.

Bit Size: 32

Provides sufficient processing power for various tasks and calculations.

Power Supplies (V): 3.3

Standard voltage level for compatibility with other components and systems.

No. of Terminals: 48

Offers a good number of connection points for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack design allows for easy integration into electronic assemblies.

Minimum Supply Voltage: 1.8 V

Supports lower power consumption and energy-efficient operation.

Maximum Operating Temperature: 85 °C

Ensures reliability and performance in a wide range of environmental conditions.

CPU Family: CORTEX-M0

Belongs to a well-known and established family of microcontrollers, ensuring compatibility and support.

Minimum Operating Temperature: -40 °C

Can operate effectively in extreme cold environments without issues.

ADC Channels: YES

Supports analog-to-digital conversion for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad arrangement of terminals allows for easy routing and connection in PCB layouts.

ROM Words: 24576

Provides ample storage capacity for program instructions and data.

Width: 7 mm

Compact width for space-constrained applications and designs.

Peripherals: BOD, POR, TIMER(5), WDT

Includes various essential peripherals for system control, monitoring, and communication.

Maximum Clock Frequency: 25 MHz

Offers high-speed processing capabilities for real-time applications and computations.

Terminal Finish: TIN

Tin finish provides good solderability and conductivity for reliable connections.

RAM Bytes: 8192

Sufficient random-access memory for storing temporary data and variables during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy mounting and soldering onto PCBs.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with 10-bit resolution for accurate analog signal conversion.

Nominal Supply Voltage: 3.3 V

Stable and commonly used voltage level for reliable operation.

Connectivity: I2C, SPI(2), UART

Supports various communication protocols for versatile connectivity with external devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible programming of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and space-saving designs.

Speed: 50 rpm

Operates at a moderate speed suitable for general-purpose applications.

On Chip Program ROM Width: 8

Offers narrow program ROM width for efficient memory usage.

No. of I/O Lines: 42

Provides a good number of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LPC1113FBD48/301,1 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

42

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FBD48/301,1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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