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LPC1112JHN33/203E

NXP Semiconductors

LPC1112JHN33/203E by NXP Semiconductors

LPC1112JHN33/203E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, an operating temp range from -40 °C to 105 °C, and 8-channel ADC. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$1.733

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,880 parts In-Stock

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$1.733

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Vyrian

USA . 5,244 parts In-Stock

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Anansix

USA . 1,997 parts In-Stock

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Digiode

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One Stop Electronics

USA . 898 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 846 parts In-Stock

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Component Stockers USA

USA . 1,285 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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UNI Independent Distributors

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Microchip USA

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Overview

Unlock the power of innovation with the LPC1112JHN33/203E microcontroller from NXP Semiconductors. Renowned for their quality and reliability, NXP brings you a versatile solution perfect for industrial applications, IoT devices, and embedded systems. With exceptional performance in a compact design, this energy-efficient chip offers seamless connectivity and robust features, enhancing your projects while driving down costs. Experience unmatched durability and flexibility, ensuring your designs stand the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the microcontroller, ensuring reliable performance in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into PCBs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, enhancing flexibility in design options.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on circuit boards, allowing for denser designs.

Bit Size: 32

A 32-bit architecture provides increased processing power and allows for handling complex computations and larger data sets.

Power Supplies (V): 3.3

Operational at 3.3 V ensures lower power consumption, which is critical for battery-operated and energy-efficient applications.

No. of Terminals: 33

Having 33 terminals enables more peripheral connections, giving designers the flexibility to incorporate additional functionalities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

A very thin profile makes it ideal for applications where space is a premium, while heat sink options help manage thermal performance.

Minimum Supply Voltage: 1.8 V

The lower minimum supply voltage of 1.8 V allows for operation in low-power mode, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, this microcontroller can be used in high-temperature environments, increasing its application range.

CPU Family: CORTEX-M0

Based on the Cortex-M0 core, it provides excellent performance-per-watt and is suitable for low-cost, low-power applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C means the microcontroller can perform reliably in harsh, cold environments.

ADC Channels: YES

The presence of ADC channels allows for direct interfacing with analog signals, making it versatile for various sensor applications.

Terminal Position: QUAD

Quad terminal positioning allows for more effective heat dissipation and improved signal integrity.

ROM Words: 16384

Having 16,384 ROM words provides substantial memory for storing application code, enabling complex program running.

Width: 7 mm

The compact width of 7 mm enhances integration potential in small devices.

Peripherals: BOD, POR, TIMER(5), WDT

Built-in peripherals like BOD, POR, timers, and watchdog timers improve the microcontroller's reliability and performance in critical applications.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for fast processing, making it suitable for real-time applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, facilitating easy production.

Length: 7 mm

The 7 mm length contributes to the overall compactness of the microcontroller, making it easy to fit into tight spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability for use in rugged industrial environments and long-term performance.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it aims for high performance and energy efficiency, which is crucial for modern embedded systems.

RAM Bytes: 4096

With 4,096 bytes of RAM, this microcontroller supports complex calculations and data handling in memory-constrained environments.

Technology: CMOS

Using CMOS technology allows for lower power consumption, making it ideal for battery-dependent applications.

Terminal Form: NO LEAD

No lead terminal form is beneficial for low-profile design and increased reliability through improved solder connections.

Analog To Digital Convertors: 8-Ch 10-Bit

Having 8 channels of 10-bit ADC enhances its ability to read multiple analog signals simultaneously, broadening application possibilities.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V strikes a balance between performance and energy efficiency.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options like I2C, SPI, and UART allow for flexible communication with a variety of devices, enhancing interoperability.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and reprogramming, supporting evolving application requirements.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm promotes compatibility with standard PCB designs while maintaining a compact footprint.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates a need for controlled handling and storage, ensuring optimal operation in various environments.

Speed: 50 rpm

A specified speed of 50 rpm may refer to motor control capabilities, making this microcontroller suitable for movement or actuator applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient handling of instructions and data, complementing the 32-bit architecture.

No. of I/O Lines: 28

With 28 I/O lines, the microcontroller provides ample interface options for sensors, actuators, and other peripherals, enhancing its functionality.

Technical Specifications

Microcontrollers LPC1112JHN33/203E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1112JHN33/203E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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