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LPC1112FHN33/203,5

NXP Semiconductors

LPC1112FHN33/203,5 by NXP Semiconductors

NXP Semiconductors' LPC1112FHN33/203,5 is a 32-bit microcontroller with 3.3V supply, 25 MHz clock frequency, and 4096 bytes of RAM. Ideal for industrial applications requiring a compact (7mm x 7mm) chip carrier package with ADC channels and multiple connectivity options like I2C and UART.

Median Price

$2.675

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 135 parts In-Stock

1+ parts

$1.550

100+ parts

$1.240

1k+ parts

$0.867

10k+ parts

$0.840

135

$1.550

$1.240

$0.867

$0.840

Rochester

USA . 67 parts In-Stock

1+ parts

$1.890

100+ parts

$1.780

1k+ parts

$1.610

10k+ parts

-

67

$1.890

$1.780

$1.610

-

DigiKey

USA . 116 parts In-Stock

1+ parts

$3.460

100+ parts

$2.145

1k+ parts

$1.960

10k+ parts

$1.811

116

$3.460

$2.145

$1.960

$1.811

Element14

Singapore . 135 parts In-Stock

1+ parts

$3.780

100+ parts

$2.730

1k+ parts

$1.870

10k+ parts

-

135

$3.780

$2.730

$1.870

-

Mouser Electronics

USA . 353 parts In-Stock

1+ parts

$4.940

100+ parts

$2.530

1k+ parts

$2.150

10k+ parts

$1.940

353

$4.940

$2.530

$2.150

$1.940

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.670

10k+ parts

-

9,880

-

-

$1.670

-

Flip Electronics (Authorized)

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

780

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,469 parts In-Stock

1+ parts

$1.796

100+ parts

-

1k+ parts

-

10k+ parts

-

3,469

$1.796

-

-

-

Vyrian

USA . 3,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,213

-

-

-

-

Anansix

USA . 1,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,240

-

-

-

-

Flip Electronics

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

780

-

-

-

-

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 250 parts In-Stock

1+ parts

$1.610

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$1.610

-

-

-

Semicontronic

India . 73 parts In-Stock

1+ parts

$1.610

100+ parts

$1.570

1k+ parts

$1.562

10k+ parts

-

73

$1.610

$1.570

$1.562

-

Corphita

USA . 192 parts In-Stock

1+ parts

$1.701

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$1.701

-

-

-

Corohmni

South Africa . 66 parts In-Stock

1+ parts

$17.995

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$17.995

-

-

-

Microchip USA

USA . 8,364 parts In-Stock

1+ parts

$24.310

100+ parts

-

1k+ parts

-

10k+ parts

-

8,364

$24.310

-

-

-

Aztec Data Supply Inc.

USA . 278 parts In-Stock

1+ parts

$35.460

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$35.460

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$49.038

100+ parts

$44.625

1k+ parts

$40.211

10k+ parts

-

2,500

$49.038

$44.625

$40.211

-

Argo Parts USA

USA . 3,362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,362

-

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Continental Prestige Electronics

USA . 2,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,999

-

-

-

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UNI Independent Distributors

Spain . 796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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796

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-

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Perfect Parts

USA . 582 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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582

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-

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Bastille Electronics

Australia . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

550

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the LPC1112FHN33/203,5 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This microcontroller is versatile and can be used in a wide range of applications, making it an essential component for your projects. With its impressive features and performance, the LPC1112FHN33/203,5 offers unparalleled value and benefits to customers looking to elevate their designs to the next level. Experience innovation at its finest with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a variety of power sources.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and processes efficiently, making it suitable for demanding tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller means that it can execute instructions quickly, optimizing performance for various applications.

ADC Channels: YES

The presence of Analog to Digital Converter channels allows for the microcontroller to interface with analog sensors and input devices, making it versatile in data acquisition applications.

Connectivity: I2C, SPI(2), UART

Multiple communication interfaces like I2C, SPI, and UART enable seamless connectivity with other devices, expanding the range of possible applications and interactions.

Technical Specifications

Microcontrollers LPC1112FHN33/203,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1112FHN33/203,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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