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LPC1112FHN33/202,5

NXP Semiconductors

LPC1112FHN33/202,5 by NXP Semiconductors

LPC1112FHN33/202,5 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

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Flip Electronics

USA . 8,000 parts In-Stock

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Vyrian

USA . 5,975 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 690 parts In-Stock

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Component Stockers USA

USA . 1,201 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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GreenTree Electronics

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Microchip USA

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Overview

Elevate your projects with the LPC1112FHN33/202,5 microcontroller from NXP Semiconductors—an industry leader renowned for quality and innovation. This versatile 32-bit MCU delivers exceptional performance in a compact package, perfect for automation, IoT devices, and embedded systems. With its low power consumption, robust connectivity options, and reliable temperature range, it ensures your designs are efficient and resilient. Experience the unbeatable value that drives success with NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material offers protection against environmental factors, ensuring long-term reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and simplifications in manufacturing, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The moderate maximum supply voltage makes this microcontroller compatible with a wide range of power sources, enhancing its versatility.

Package Shape: SQUARE

Square package shape facilitates efficient use of PCB space and easier integration into existing designs.

Bit Size: 32

The 32-bit architecture enables the handling of complex computations, suitable for advanced applications requiring higher processing capabilities.

Power Supplies (V): 3.3

Operating on a 3.3V power supply makes the microcontroller energy-efficient while maintaining performance.

No. of Terminals: 33

A higher number of terminals provides greater flexibility for peripheral connections, enhancing the functionality of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Very thin profile allows for compact designs while facilitating better thermal management when necessary.

Minimum Supply Voltage: 1.8 V

The capability to function at a lower voltage expands its usability in low-power applications, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C makes it suitable for industrial environments where heat dissipation may be a concern.

CPU Family: CORTEX-M0

Cortex-M0 architecture provides a good balance of performance and power efficiency—ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

Withstanding extreme low temperatures, this microcontroller can be reliably used in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent connectivity and longevity in connections, minimizing the risk of corrosion.

ADC Channels: YES

Built-in ADC channels allow for direct interfacing with sensors, simplifying system designs and reducing component count.

Terminal Position: QUAD

Quad terminal positioning offers robust mounting and reliable connections, improving overall durability.

ROM Words: 16384

A significant amount of ROM allows for ample program storage, enabling the implementation of complex applications.

Width: 7 mm

Compact width aids in space-saving designs, making it suitable for portable devices and applications.

Peripherals: BOD, POR, TIMER(5), WDT

Integrated peripherals enhance functionality and allow for advanced power management and timing applications.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for efficient processing, making it suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Supports standard reflow soldering processes, facilitating ease of assembly in manufacturing.

Peak Reflow Temperature °C: 260

Withstanding high reflow temperatures ensures compatibility with modern manufacturing techniques.

Length: 7 mm

Small length contributes to compact design, ideal for applications where board space is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings signify suitability for harsh conditions and longevity in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient instruction execution, enhancing performance and decreasing power consumption.

RAM Bytes: 4096

Adequate RAM enables more complex operations and multitasking capabilities for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing reliability in various applications.

Terminal Form: NO LEAD

No lead design improves environmental safety and allows for more compact assembly options.

Analog To Digital Convertors: 8-Ch 10-Bit

Integrated 8-channel ADC allows for versatile data acquisition from various analog sensors.

Nominal Supply Voltage: 3.3 V

Standard nominal voltage simplifies design considerations and enables compatibility with common components.

Connectivity: I2C, SPI, UART

Diverse connectivity options enable easy integration with various peripherals and devices, enhancing application flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, ensuring the microcontroller remains adaptable to changing requirements.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables compact PCB designs, maximizing the use of available space on the board.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable handling requirements, making it suitable for various environments.

Speed: 50 rpm

Allows for dynamic performance, especially in control applications requiring timely responses.

On Chip Program ROM Width: 8

8-bit program ROM width enhances compatibility with various software architectures and simplifies programming.

No. of I/O Lines: 28

A good number of I/O lines allows for extensive interfacing with multiple components or sensors, making it highly versatile.

Technical Specifications

Microcontrollers LPC1112FHN33/202,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1112FHN33/202,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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