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LPC1112FHN33/103,5

NXP Semiconductors

LPC1112FHN33/103,5 by NXP Semiconductors

The LPC1112FHN33/103.5 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, an operating temp range of -40 °C to 85 °C, and 28 I/O lines. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity with integrated ADC channels. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$2.497

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 260 parts In-Stock

1+ parts

$3.270

100+ parts

$2.018

1k+ parts

$1.843

10k+ parts

$1.701

260

$3.270

$2.018

$1.843

$1.701

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.724

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9,880

-

-

$1.724

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Flip Electronics (Authorized)

USA . 515 parts In-Stock

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515

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Distributors (In-Stock)

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Digiode

USA . 4,567 parts In-Stock

1+ parts

$2.717

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-

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4,567

$2.717

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Vyrian

USA . 2,919 parts In-Stock

1+ parts

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2,919

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Flip Electronics

USA . 515 parts In-Stock

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515

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Anansix

USA . 363 parts In-Stock

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363

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Distributors (Availability)

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Corphita

USA . 2,038 parts In-Stock

1+ parts

$2.574

100+ parts

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2,038

$2.574

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Component Stockers USA

USA . 487 parts In-Stock

1+ parts

$3.270

100+ parts

$2.090

1k+ parts

-

10k+ parts

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487

$3.270

$2.090

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Microchip USA

USA . 2,015 parts In-Stock

1+ parts

$22.815

100+ parts

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2,015

$22.815

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$46.992

100+ parts

$42.763

1k+ parts

$38.533

10k+ parts

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3,000

$46.992

$42.763

$38.533

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UNI Independent Distributors

Spain . 605 parts In-Stock

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605

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Overview

Unlock your project’s potential with the LPC1112FHN33/103.5 microcontroller from NXP Semiconductors, designed for excellence in performance and reliability. With its versatile connectivity options and robust temperature range, this compact powerhouse is ideal for industrial applications, IoT devices, and consumer electronics. Trust in NXP's legacy of quality to enhance your designs, streamline development, and deliver cutting-edge solutions that stand out in the competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection against environmental factors, leading to a reliable performance.

Surface Mount: YES

Surface mount technology facilitates compact and efficient PCB design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This voltage range allows the microcontroller to work efficiently with common power supplies and peripherals.

Package Shape: SQUARE

The square shape optimizes space on the PCB, allowing for better integration into designs.

Bit Size: 32

The 32-bit architecture enables enhanced processing power and capabilities, accommodating complex applications.

Power Supplies (V): 3.3

Operating at 3.3 V ensures compatibility with most modern digital devices and sensors.

No. of Terminals: 33

A higher number of terminals provides more interfacing options for connecting various components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design enhances thermal management and integration into compact designs.

Minimum Supply Voltage: 1.8 V

The lower voltage requirement allows for operation in power-sensitive applications, improving energy efficiency.

Maximum Operating Temperature: 85 °C

This high operating temperature rating makes the microcontroller suitable for industrial environments.

CPU Family: CORTEX-M0

The Cortex-M0 architecture offers an energy-efficient solution with a strong balance between performance and power consumption.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliability in extreme environmental conditions.

ADC Channels: YES

Analog-to-digital conversion capabilities allow for the processing of analog signals, broadening application areas.

Terminal Position: QUAD

Quadrant position aids in efficient soldering and maximizing the use of PCB space.

ROM Words: 16384

A significant amount of ROM allows for complex applications and ample room for program storage.

Width: 7 mm

The compact width aids in space-saving designs while maintaining performance.

Peripherals: BOD, POR, TIMER(5), WDT

Integrated peripherals enhance functionality and system reliability without needing additional components.

Maximum Clock Frequency: 25 MHz

The sufficient clock frequency allows for real-time processing and efficient execution of tasks.

Peak Reflow Temperature °C: 260

This high reflow temperature makes it suitable for modern manufacturing processes.

Length: 7 mm

The small length contributes to a compact design, ideal for modern electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and durability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes efficient instruction execution, boosting performance.

RAM Bytes: 2048

A good amount of RAM facilitates efficient operation and improves overall system performance.

Technology: CMOS

CMOS technology contributes to low power consumption, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

The lead-free design meets modern environmental regulations and standards.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple ADC channels enhance the ability to interface with various sensors and devices.

Nominal Supply Voltage: 3.3 V

Maintaining a nominal voltage of 3.3 V ensures compatibility with commonly used devices.

Connectivity: I2C, SPI(2), UART

Versatile connectivity options allow for efficient communication with other devices and microcontrollers.

ROM Programmability: FLASH

Flash programmability allows for reprogramming and updates, ensuring longevity and adaptability in applications.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for a compact layout on the PCB, supporting high-density designs.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity, guiding proper handling and storage to prevent damage.

Speed: 50 rpm

The specified speed can be advantageous in low-speed application scenarios, enhancing efficiency.

On Chip Program ROM Width: 8

The 8-bit program ROM width allows handling of efficient algorithms within the microcontroller.

No. of I/O Lines: 28

28 I/O lines provide flexible interfacing capabilities with assorted devices and systems.

Technical Specifications

Microcontrollers LPC1112FHN33/103,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1112FHN33/103,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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