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LPC1112FHN24/202,1

NXP Semiconductors

LPC1112FHN24/202,1 by NXP Semiconductors

LPC1112FHN24/202,1 from NXP is a 32-bit microcontroller ideal for industrial applications. It operates at 1.8-3.6V with a max temp of 85 °C, featuring 19 I/O lines and 6 ADC channels. Its compact design supports I2C, SPI, and UART connectivity for versatile use.

Median Price

$1.694

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

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Rochester

USA . 1,819 parts In-Stock

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$1.600

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$1.430

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$1.340

1,819

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$1.600

$1.430

$1.340

Verical

USA . 1,819 parts In-Stock

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$1.788

10k+ parts

$1.675

1,819

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$1.788

$1.675

Distributors (In-Stock)

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Digiode

USA . 3,853 parts In-Stock

1+ parts

$1.520

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Flip Electronics

USA . 12,000 parts In-Stock

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Vyrian

USA . 10,343 parts In-Stock

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Connector Distribution Corp

USA . 2,450 parts In-Stock

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2,450

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Right Parts Inc.

USA . 2,450 parts In-Stock

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2,450

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Anansix

USA . 2,148 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,266 parts In-Stock

1+ parts

$1.440

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$1.440

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AZTECH Wire

Italy . 250 parts In-Stock

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$18.630

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$18.630

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Microchip USA

USA . 11,664 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,937 parts In-Stock

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UNI Independent Distributors

Spain . 4,747 parts In-Stock

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Overview

Unlock innovation with the LPC1112FHN24/202,1 from NXP Semiconductors, a high-performance microcontroller designed for diverse applications. Its robust design ensures reliability even in extreme conditions, making it perfect for industrial automation and IoT solutions. Experience seamless connectivity with integrated I2C, SPI, and UART interfaces while enjoying low power consumption. Trust in NXP’s quality and elevate your projects to new heights of efficiency and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures durability and a lightweight design, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for a compact design, facilitating easier integration into space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

Package Shape: SQUARE

The square package shape is ideal for optimized PCB layout, making it easier to design efficient circuits.

Bit Size: 32

Being a 32-bit microcontroller enables increased processing power and performance for complex applications.

Power Supplies (V): 3.3

Designed to operate at 3.3 V, ensuring energy efficiency and compatibility with modern digital circuits.

No. of Terminals: 24

With 24 terminals, it offers numerous connections for input/output, enhancing versatility in application designs.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides effective heat dissipation while maintaining a very low profile, suited for compact electronics.

Minimum Supply Voltage: 1.8 V

Supports a wide voltage range from 1.8 V, allowing the microcontroller to function in various power conditions.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes it suitable for industrial environments and demanding applications.

CPU Family: CORTEX-M0

Utilizing the ARM Cortex-M0, this microcontroller provides a balance of processing power and low energy consumption.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is ideal for applications in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent conductivity and corrosion resistance, enhancing reliability in long-term use.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, increasing the range of applications.

Terminal Position: QUAD

Quad terminal positioning facilitates PC design flexibility and simplifies connections on the PCB.

ROM Words: 16384

With 16,384 ROM words, it provides ample space for program storage in embedded applications.

Width: 4 mm

A compact width of 4 mm enhances integration into densely packed assemblies.

Peripherals: BOD, POR, TIMER(5), WDT

Various peripherals enhance the functionality and robustness of designs, offering features like power-on reset and watchdog timers.

Maximum Clock Frequency: 25 MHz

With a clock frequency of 25 MHz, this microcontroller can execute instructions swiftly, improving responsiveness in applications.

Maximum Time At Peak Reflow Temperature: 30s

Allows for adherence to industry soldering standards, ensuring a reliable assembly without damage to the microcontroller.

Peak Reflow Temperature: 260 °C

A high reflow temperature tolerance makes this microcontroller suitable for modern assembly techniques.

Length: 4 mm

Its 4 mm length contributes to a compact footprint, enabling usage in miniaturized devices.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this microcontroller can withstand harsh conditions found in industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction processing, optimizing performance and power consumption.

RAM Bytes: 2048

With 2048 bytes of RAM, it allows for dynamic data storage, enhancing program performance.

Technology: CMOS

Utilizing CMOS technology for low static power consumption, improving energy efficiency in battery-operated applications.

Terminal Form: NO LEAD

No lead terminals allow for a more compact design, reducing the size and weight of the final product.

Analog To Digital Converters: 6-Ch 10-Bit

The onboard 6-channel, 10-bit ADC allows for versatile signal processing, accommodating a variety of input types.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V makes it compatible with standard electronic components and modules.

Connectivity: I2C, SPI, UART

Diverse connectivity options like I2C, SPI, and UART enable easy integration with other sensors and devices.

ROM Programmability: FLASH

FLASH programmability allows for easy reprogramming and updates, extending the product's lifecycle.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm aids in high-density PCB designs, saving space without compromising functionality.

Speed: 50 rpm

An operational speed of 50 rpm can cater to applications requiring low-speed, controlled processes.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances instruction flexibility and allows for efficient coding practices.

No. of I/O Lines: 19

With 19 I/O lines, the microcontroller can interface with numerous peripherals, providing extensive functionality.

Technical Specifications

Microcontrollers LPC1112FHN24/202,1 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

19

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LPC1112FHN24/202,1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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