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LPC1112FHI33/203,5

NXP Semiconductors

LPC1112FHI33/203,5 by NXP Semiconductors

LPC1112FHI33/203,5 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile connectivity. Ideal for industrial applications requiring compact design and efficient performance.

Median Price

$3.610

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 742 parts In-Stock

1+ parts

$3.610

100+ parts

$2.500

1k+ parts

$1.970

10k+ parts

$1.920

742

$3.610

$2.500

$1.970

$1.920

DigiKey

USA . 70 parts In-Stock

1+ parts

$3.610

100+ parts

$2.247

1k+ parts

$2.002

10k+ parts

$1.929

70

$3.610

$2.247

$2.002

$1.929

Verical

USA . 9,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.928

10k+ parts

-

9,800

-

-

$1.928

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 939 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

-

10k+ parts

-

939

$3.002

-

-

-

Flip Electronics

USA . 7,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,840

-

-

-

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Vyrian

USA . 2,819 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,819

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-

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IBS Electronics

USA . 1,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.258

10k+ parts

$2.230

1,960

-

-

$2.258

$2.230

Anansix

USA . 1,017 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,017

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-

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NAC Semi

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.260

10k+ parts

-

980

-

-

$2.260

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,026 parts In-Stock

1+ parts

$2.844

100+ parts

-

1k+ parts

-

10k+ parts

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1,026

$2.844

-

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Microchip USA

USA . 5,341 parts In-Stock

1+ parts

$25.545

100+ parts

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1k+ parts

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10k+ parts

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5,341

$25.545

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QUARKTWIN TECHNOLOGY LTD

USA . 29,475 parts In-Stock

1+ parts

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29,475

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UNI Independent Distributors

Spain . 4,280 parts In-Stock

1+ parts

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100+ parts

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4,280

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,000

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Overview

Unlock unparalleled performance with the LPC1112FHI33/203,5 microcontroller from NXP Semiconductors. Renowned for superior quality and innovation, NXP empowers your projects with a versatile, energy-efficient solution perfect for industrial applications. With its robust design and advanced features, harness seamless connectivity and dependable operation in even the most demanding environments. Elevate your designs and achieve success with NXP's trusted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material ensures durability and protection against environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and efficient manufacturing, maximizing board space.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V makes it compatible with a variety of systems while ensuring low power consumption.

Package Shape: SQUARE

The square package shape facilitates efficient placement on PCBs, ideal for high-density applications.

Bit Size: 32

A 32-bit architecture enhances processing power and allows for handling complex calculations and larger data sets efficiently.

Power Supplies (V): 3.3

Operating at 3.3V ensures energy efficiency, making it suitable for battery-operated applications.

No. of Terminals: 33

Having 33 terminals provides flexibility for various connections, allowing for extensive interfacing options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability help in space-constrained environments, ensuring effective thermal management.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage of 1.8V enables operation in low-power environments, ideal for portable applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliable performance in a variety of industrial settings.

CPU Family: CORTEX-M0

The Cortex-M0 family provides a power-efficient architecture optimized for low-cost microcontroller applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this microcontroller suitable for extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish enhances reliability and provides excellent corrosion resistance.

ADC Channels: YES

Integrated ADC channels provide the capability for analog signal processing, enhancing the versatility of the microcontroller.

Terminal Position: QUAD

The quad terminal position improves connectivity options for easier design integration.

ROM Words: 16384

With 16384 ROM words, it provides ample storage for user programs, allowing for versatile application development.

Width: 7 mm

The compact width makes it suitable for small form-factor designs, including wearables and other compact devices.

Peripherals: BOD, POR, TIMER(5), WDT

Integrated peripherals enhance functionality, allowing for better control and utility in various applications.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz supports efficient processing performance for most applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds indicates robustness during the soldering process, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability indicates durability during manufacturing processes.

Length: 7 mm

A length of 7 mm contributes to its compact design, making it ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures it can handle demanding environments, suitable for commercial and industrial use.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers a highly efficient instruction set, leading to improved performance.

RAM Bytes: 4096

4096 bytes of RAM provide adequate memory for handling complex tasks and operations in application development.

Technology: CMOS

The CMOS technology ensures low power consumption and high speed, making it efficient for various applications.

Terminal Form: NO LEAD

No-lead terminal forms enhance the ability to compactly package the microcontroller, useful for miniaturized designs.

Analog To Digital Converters: 8-Ch 10-Bit

Having 8-channel 10-bit ADCs provides versatile data acquisition capabilities for numerous applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V maintains efficiency in power consumption while delivering necessary performance.

Connectivity: I2C, SPI(2), UART

Rich connectivity options such as I2C, SPI, and UART expand the range of applications and peripherals it can support.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, enhancing long-term usability and flexibility.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is suitable for modern PCB designs, allowing for increased component density.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates good reliability in humid conditions, making it fit for various environments.

Speed: 50 rpm

The moderate operational speed of 50 rpm supports a wide range of applications, providing suitable performance for most tasks.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for effective storage and execution of wide applications, enhancing microcontroller efficiency.

No. of I/O Lines: 28

With 28 I/O lines, it offers flexibility and versatility in interfacing with other components and sensors.

Technical Specifications

Microcontrollers LPC1112FHI33/203,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1112FHI33/203,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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