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LPC1112FHI33/202,5

NXP Semiconductors

LPC1112FHI33/202,5 by NXP Semiconductors

NXP Semiconductors' LPC1112FHI33/202,5 is a 32-bit microcontroller with 3.3V supply, 25 MHz clock frequency, and 2048 bytes of RAM. Ideal for industrial applications, it features ADC channels, UART connectivity, and flash ROM programmability.

Median Price

$2.050

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 38 parts In-Stock

1+ parts

$1.970

100+ parts

$1.390

1k+ parts

$1.010

10k+ parts

$0.899

38

$1.970

$1.390

$1.010

$0.899

Arrow

USA . 980 parts In-Stock

1+ parts

$2.863

100+ parts

-

1k+ parts

$2.050

10k+ parts

-

980

$2.863

-

$2.050

-

Element14

Singapore . 38 parts In-Stock

1+ parts

$4.000

100+ parts

$2.720

1k+ parts

$1.970

10k+ parts

$1.700

38

$4.000

$2.720

$1.970

$1.700

Rochester

USA . 2,918 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.370

10k+ parts

$1.290

2,918

-

$1.530

$1.370

$1.290

Verical

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.050

10k+ parts

-

980

-

-

$2.050

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 513 parts In-Stock

1+ parts

$1.615

100+ parts

-

1k+ parts

-

10k+ parts

-

513

$1.615

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.412

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.412

-

-

-

Vyrian

USA . 6,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,321

-

-

-

-

Anansix

USA . 2,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,655

-

-

-

-

NAC Semi

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.260

10k+ parts

-

980

-

-

$2.260

-

IBS Electronics

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.911

10k+ parts

$1.885

980

-

-

$1.911

$1.885

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,869 parts In-Stock

1+ parts

$1.440

100+ parts

-

1k+ parts

-

10k+ parts

-

2,869

$1.440

-

-

-

Semicontronic

India . 2,696 parts In-Stock

1+ parts

$1.440

100+ parts

$1.404

1k+ parts

$1.397

10k+ parts

-

2,696

$1.440

$1.404

$1.397

-

Corphita

USA . 4,479 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

4,479

$1.530

-

-

-

Corohmni

South Africa . 207 parts In-Stock

1+ parts

$2.106

100+ parts

-

1k+ parts

-

10k+ parts

-

207

$2.106

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.364

100+ parts

-

1k+ parts

$2.269

10k+ parts

-

1,000

$2.364

-

$2.269

-

Continental Prestige Electronics

USA . 1,711 parts In-Stock

1+ parts

$2.412

100+ parts

-

1k+ parts

-

10k+ parts

$2.364

1,711

$2.412

-

-

$2.364

Argo Parts USA

USA . 276 parts In-Stock

1+ parts

$2.412

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$2.412

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$2.460

100+ parts

$2.460

1k+ parts

$2.460

10k+ parts

-

350

$2.460

$2.460

$2.460

-

AZTECH Wire

Italy . 143 parts In-Stock

1+ parts

$8.270

100+ parts

-

1k+ parts

-

10k+ parts

-

143

$8.270

-

-

-

Aztec Data Supply Inc.

USA . 229 parts In-Stock

1+ parts

$84.660

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$84.660

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,356 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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29,356

-

-

-

-

Microchip USA

USA . 10,979 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,979

-

-

-

-

UNI Independent Distributors

Spain . 3,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,775

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Discover the LPC1112FHI33/202,5 by NXP Semiconductors - a top-quality microcontroller designed to meet your specific needs with precision and reliability. From industrial applications to IoT devices, this versatile component offers cutting-edge technology in a compact package. With a wide range of peripherals and connectivity options, this product provides seamless integration and enhanced functionality for your projects. Trust NXP Semiconductors for unmatched performance and value in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring product longevity and ease of handling.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating various voltage requirements.

Bit Size: 32

32-bit architecture provides enhanced processing capability and performance for complex applications.

No. of Terminals: 33

Sufficient number of terminals for connecting to external components and peripherals, enabling versatile system configurations.

ADC Channels: YES

Integrated analog to digital converters for accurate and efficient conversion of analog signals to digital data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient instruction execution and improved performance of the microcontroller.

RAM Bytes: 2048

Adequate RAM capacity for storing and accessing data, enhancing the overall processing speed and multitasking capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy and convenient updating of the program memory, facilitating rapid prototyping and development cycles.

Connectivity: I2C, SPI, UART

Support for multiple communication protocols enables easy interfacing with a variety of devices and peripherals, enhancing the connectivity options.

Technical Specifications

Microcontrollers LPC1112FHI33/202,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1112FHI33/202,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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