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LPC1111FHN33/202,5

NXP Semiconductors

LPC1111FHN33/202,5 by NXP Semiconductors

NXP Semiconductors' LPC1111FHN33/202,5 is a 32-bit microcontroller with 3.3V supply, 25MHz clock speed, and 4096 bytes of RAM. Ideal for industrial applications, it features ADC channels, I2C/SPI/UART connectivity, and on-chip Flash ROM programmability.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50 parts In-Stock

1+ parts

$1.090

100+ parts

$1.070

1k+ parts

$1.050

10k+ parts

-

50

$1.090

$1.070

$1.050

-

Newark

USA . 299 parts In-Stock

1+ parts

$2.320

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$2.320

-

-

-

Farnell

UK . 227 parts In-Stock

1+ parts

$2.840

100+ parts

$1.620

1k+ parts

$1.490

10k+ parts

-

227

$2.840

$1.620

$1.490

-

Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$4.330

100+ parts

$2.260

1k+ parts

$1.730

10k+ parts

-

33

$4.330

$2.260

$1.730

-

Element14

Singapore . 119 parts In-Stock

1+ parts

$5.700

100+ parts

$2.930

1k+ parts

$2.370

10k+ parts

$2.360

119

$5.700

$2.930

$2.370

$2.360

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.462

10k+ parts

-

9,880

-

-

$1.462

-

RS (Exports)

UK . 4,940 parts In-Stock

1+ parts

-

100+ parts

$1.651

1k+ parts

-

10k+ parts

-

4,940

-

$1.651

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,443 parts In-Stock

1+ parts

$1.036

100+ parts

-

1k+ parts

-

10k+ parts

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3,443

$1.036

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.020

100+ parts

-

1k+ parts

-

10k+ parts

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10

$2.020

-

-

-

Maritex

Poland . 19 parts In-Stock

1+ parts

$3.677

100+ parts

-

1k+ parts

-

10k+ parts

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19

$3.677

-

-

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Vyrian

USA . 5,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,226

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-

-

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Flip Electronics

USA . 3,120 parts In-Stock

1+ parts

-

100+ parts

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3,120

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-

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Anansix

USA . 1,181 parts In-Stock

1+ parts

-

100+ parts

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1,181

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-

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Classic Components Corporation

USA . 25 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 643 parts In-Stock

1+ parts

$0.930

100+ parts

-

1k+ parts

-

10k+ parts

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643

$0.930

-

-

-

Corphita

USA . 2,692 parts In-Stock

1+ parts

$0.981

100+ parts

-

1k+ parts

-

10k+ parts

-

2,692

$0.981

-

-

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Vigor

Singapore . 1,466 parts In-Stock

1+ parts

$1.090

100+ parts

-

1k+ parts

-

10k+ parts

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1,466

$1.090

-

-

-

Argo Parts USA

USA . 3,470 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

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3,470

$1.910

-

-

-

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$1.948

100+ parts

$1.948

1k+ parts

$1.948

10k+ parts

-

15

$1.948

$1.948

$1.948

-

Continental Prestige Electronics

USA . 430 parts In-Stock

1+ parts

$3.500

100+ parts

$1.960

1k+ parts

$1.790

10k+ parts

-

430

$3.500

$1.960

$1.790

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Aztec Data Supply Inc.

USA . 1,594 parts In-Stock

1+ parts

$45.361

100+ parts

-

1k+ parts

-

10k+ parts

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1,594

$45.361

-

-

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$80.759

100+ parts

-

1k+ parts

-

10k+ parts

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59

$80.759

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 11,683 parts In-Stock

1+ parts

-

100+ parts

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11,683

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UNI Independent Distributors

Spain . 4,555 parts In-Stock

1+ parts

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100+ parts

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4,555

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Microchip USA

USA . 4,399 parts In-Stock

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4,399

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.980

1k+ parts

$1.919

10k+ parts

$1.879

500

-

$1.980

$1.919

$1.879

Overview

Unlock the power of innovation with the LPC1111FHN33/202,5 by NXP Semiconductors. This high-quality microcontroller offers unrivaled performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to IoT devices, this Cortex-M0 CPU family member delivers impressive speed and connectivity options like I2C, SPI, and UART. With its compact size and advanced features, the LPC1111FHN33/202,5 provides exceptional value and benefits to customers looking to stay ahead in today's fast-paced tech landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of high-quality plastic/epoxy material ensures durability and reliability in various environments.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort in production processes.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply compatibility, making it versatile for different applications.

Package Shape: SQUARE

The square shape provides a compact and space-saving design, ideal for applications with limited space constraints.

Bit Size: 32

Offers a high processing capability and precision, suitable for handling complex tasks efficiently.

Power Supplies (V): 3.3

Operates at a common voltage level, ensuring compatibility with various components in a system.

No. of Terminals: 33

Provides ample connectivity options for interfacing with other devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The varied package styles cater to different mounting and cooling needs, enhancing flexibility in design.

Minimum Supply Voltage: 1.8 V

Allows for lower power consumption and efficiency in energy usage, ideal for battery-operated applications.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, ensuring reliable performance even in demanding thermal conditions.

Technical Specifications

Microcontrollers LPC1111FHN33/202,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1111FHN33/202,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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