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BUK9E4R4-80E,127

NXP Semiconductors

BUK9E4R4-80E,127 by NXP Semiconductors

NXP Semiconductors BUK9E4R4-80E,127 is a N-channel Power FET with 80V DS breakdown voltage and 715A pulsed drain current. Ideal for switching applications, it features a built-in diode, 0.0044 ohm max on-resistance, and operates in enhancement mode.

Median Price

$2.415

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 295 parts In-Stock

1+ parts

-

100+ parts

$2.280

1k+ parts

$2.040

10k+ parts

$1.920

295

-

$2.280

$2.040

$1.920

Verical

USA . 295 parts In-Stock

1+ parts

-

100+ parts

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$2.550

10k+ parts

$2.400

295

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-

$2.550

$2.400

Distributors (In-Stock)

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Digiode

USA . 3,325 parts In-Stock

1+ parts

$1.235

100+ parts

-

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3,325

$1.235

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Vyrian

USA . 8,387 parts In-Stock

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8,387

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Anansix

USA . 2,238 parts In-Stock

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2,238

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Distributors (Availability)

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Native Components

USA . 685 parts In-Stock

1+ parts

$0.485

100+ parts

-

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-

10k+ parts

$0.466

685

$0.485

-

-

$0.466

Northwest PG Solutions

USA . 2,063 parts In-Stock

1+ parts

$0.534

100+ parts

-

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-

10k+ parts

$0.470

2,063

$0.534

-

-

$0.470

Corphita

USA . 374 parts In-Stock

1+ parts

$1.170

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-

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374

$1.170

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Andel Nordic

Denmark . 5,937 parts In-Stock

1+ parts

$5.850

100+ parts

-

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$5.616

10k+ parts

$5.616

5,937

$5.850

-

$5.616

$5.616

Microchip USA

USA . 9,332 parts In-Stock

1+ parts

$8.125

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9,332

$8.125

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AZTECH Wire

Italy . 834 parts In-Stock

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$19.150

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834

$19.150

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UNI Independent Distributors

Spain . 4,016 parts In-Stock

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4,016

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Continental Prestige Electronics

USA . 295 parts In-Stock

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$1.560

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295

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$1.560

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Overview

Power up your devices with the BUK9E4R4-80E,127 by NXP Semiconductors! This high-quality Power FET offers reliable performance in switching applications, making it a versatile choice for a variety of electronic projects. With a maximum pulsed drain current of 715 A and a minimum DS breakdown voltage of 80 V, this transistor delivers exceptional power and efficiency. Trust in NXP Semiconductors' reputation for excellence and innovation to bring you the best in semiconductor technology. Upgrade your designs with the BUK9E4R4-80E,127 and experience the superior quality and performance that sets NXP Semiconductors apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and insulation, protecting the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower on-resistance compared to P-channel FETs, making them a popular choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse voltage, enhancing the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast operation and high efficiency in controlling the flow of current.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80V, this FET can handle high voltage levels, making it suitable for a variety of power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low on-resistance, making this FET efficient and reliable for power management.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high-temperature environments, increasing its versatility in different applications.

Technical Specifications

Power Field Effect Transistors (FET) BUK9E4R4-80E,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

488 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0044 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

715 A

Reference Standard:

AEC-Q101; IEC-60134

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK9E4R4-80E,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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