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BLL1214-250R,112

NXP Semiconductors

BLL1214-250R,112 by NXP Semiconductors

BLL1214-250R,112 by NXP Semiconductors is a single N-channel enhancement mode FET ideal for high-power applications. It boasts a max power dissipation of 400 W and operates effectively up to 150 °C. This MOSFET is perfect for efficient power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,459 parts In-Stock

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6,459

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Digiode

USA . 2,351 parts In-Stock

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2,351

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Anansix

USA . 1,931 parts In-Stock

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1,931

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Distributors (Availability)

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AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$16.610

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50

$16.610

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One Stop Electronics

USA . 869 parts In-Stock

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$57.050

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869

$57.050

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Native Components

USA . 983 parts In-Stock

1+ parts

$87.330

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$83.837

983

$87.330

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$83.837

Northwest PG Solutions

USA . 1,876 parts In-Stock

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$96.063

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1,876

$96.063

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Corphita

USA . 3,396 parts In-Stock

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3,396

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UNI Independent Distributors

Spain . 2,644 parts In-Stock

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Overview

Unlock superior performance with the BLL1214-250R,112 from NXP Semiconductors, a leader in innovative power solutions. This N-channel FET is designed for efficiency and reliability, making it ideal for demanding applications in industrial and automotive systems. Experience enhanced energy savings and robust power management while benefiting from NXP’s renowned quality and support. Elevate your projects and ensure lasting success with this powerful transistor at your side!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher efficiency and faster switching speeds compared to P-channel FETs, making them ideal for high-speed applications.

Configuration: SINGLE

A single configuration allows for simplified circuit design and integration, making it easier to use in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and can be turned off completely, providing better control in complex circuits.

Maximum Power Dissipation (Abs): 400 W

With a maximum power dissipation of 400 W, this FET can handle substantial loads, ensuring reliability in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for smaller and more power-efficient designs, benefiting both performance and thermal management.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures stable performance in high-temperature environments, increasing the versatility of the product.

Technical Specifications

Power Field Effect Transistors (FET) BLL1214-250R,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Trade Compliance

BLL1214-250R,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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