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BLF404,115

NXP Semiconductors

BLF404,115 by NXP Semiconductors

NXP Semiconductors BLF404,115 is a single N-CHANNEL FET with 1.5A max drain current and 8.3W power dissipation. Ideal for applications requiring high-power amplification in enhancement mode operation up to 200°C, utilizing metal-oxide semiconductor technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,225 parts In-Stock

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Digiode

USA . 2,850 parts In-Stock

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2,850

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Anansix

USA . 2,039 parts In-Stock

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2,039

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VNN

France . 587 parts In-Stock

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587

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Nova Conductors

Japan . 80 parts In-Stock

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80

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Distributors (Availability)

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AZTECH Wire

Italy . 716 parts In-Stock

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$6.816

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716

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Ampacity Inc.

Singapore . 1,303 parts In-Stock

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$39.050

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One Stop Electronics

USA . 566 parts In-Stock

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$45.050

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566

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Component Stockers USA

USA . 653 parts In-Stock

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$99.990

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Corphita

USA . 4,459 parts In-Stock

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4,459

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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UNI Independent Distributors

Spain . 274 parts In-Stock

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Overview

Unleash the power of innovation with the BLF404,115 by NXP Semiconductors, a top-tier manufacturer known for its cutting-edge technology. This Power Field Effect Transistor (FET) offers unparalleled performance and reliability in a compact, single-channel configuration. Ideal for a wide range of applications, from consumer electronics to industrial automation, this N-CHANNEL FET operates in enhancement mode, delivering exceptional efficiency and power handling capabilities. Experience the value of superior quality and performance with the BLF404,115 - your key to unlocking limitless possibilities.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower on-resistance and higher switching speeds compared to P-CHANNEL FETs, making them a good choice for applications requiring high efficiency.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and improves reliability by reducing the number of components required.

Surface Mount: YES

Surface mount FETs are easier to integrate into compact electronic designs and facilitate automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily switched on and off with a low gate voltage, making them suitable for applications requiring precise control.

Maximum Drain Current (Abs): 1.5 A

High maximum drain current rating allows this FET to handle larger loads or currents, making it suitable for power applications.

Maximum Power Dissipation (Abs): 8.3 W

With a high maximum power dissipation rating, this FET can handle higher power levels without overheating, ensuring reliable operation under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics such as low gate leakage and high input impedance, making it suitable for various applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this FET can withstand harsh environments and high-temperature conditions, ensuring long-term reliability.

Maximum Drain Current (ID): 1.5 A

Same as Maximum Drain Current (Abs)

Technical Specifications

Power Field Effect Transistors (FET) BLF404,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

BLF404,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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