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BLF2043,135

NXP Semiconductors

BLF2043,135 by NXP Semiconductors

BLF2043,135 by NXP Semiconductors is an N-channel MOSFET designed for high-performance applications. It supports a max drain current of 2.2 A and operates up to 200 °C, making it ideal for power amplification in RF circuits. This single configuration FET ensures efficient energy management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,354 parts In-Stock

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6,354

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Digiode

USA . 2,398 parts In-Stock

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2,398

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Anansix

USA . 2,359 parts In-Stock

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2,359

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Native Components

USA . 338 parts In-Stock

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$0.729

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338

$0.729

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Northwest PG Solutions

USA . 2,151 parts In-Stock

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$0.802

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2,151

$0.802

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AZTECH Wire

Italy . 907 parts In-Stock

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$11.720

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907

$11.720

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One Stop Electronics

USA . 1,145 parts In-Stock

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$53.050

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$53.050

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UNI Independent Distributors

Spain . 8,035 parts In-Stock

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Corphita

USA . 1,253 parts In-Stock

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Overview

Unlock new levels of performance with the BLF2043,135 from NXP Semiconductors—a leader in innovation and reliability. This powerful N-channel FET offers exceptional efficiency and thermal stability, making it ideal for demanding applications such as RF amplification and power management. Experience enhanced durability and superior quality that translates into longer-lasting solutions for your projects, ensuring you stay ahead in a competitive landscape.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility, which leads to faster switching times and lower on-resistance, making this transistor efficient for various applications.

Configuration: SINGLE

A single configuration simplifies integration into circuits, providing a compact solution with minimal complexity for designers.

Maximum Drain Current (Abs) (ID): 2.2 A

With a maximum drain current of 2.2 A, this FET is suitable for moderate-power applications, ensuring it can handle significant loads while maintaining reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-density integration, low power consumption, and excellent scaling, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 200 °C

The high operating temperature of 200 °C makes this FET suitable for demanding environments, enhancing reliability and longevity in applications exposed to heat.

Technical Specifications

Power Field Effect Transistors (FET) BLF2043,135 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2.2 A

Maximum Drain Current (ID):

2.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF2043,135 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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