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BLF1043,135

NXP Semiconductors

BLF1043,135 by NXP Semiconductors

BLF1043,135 by NXP Semiconductors is an N-channel enhancement mode FET designed for efficient power management. It supports a max drain current of 2.2 A and operates up to 200 °C, making it ideal for high-temperature applications in electronics. This surface-mount transistor excels in power amplification and switching tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,483 parts In-Stock

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Digiode

USA . 4,415 parts In-Stock

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Anansix

USA . 155 parts In-Stock

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155

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Native Components

USA . 241 parts In-Stock

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$1.385

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241

$1.385

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Northwest PG Solutions

USA . 2,115 parts In-Stock

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$1.523

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2,115

$1.523

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AZTECH Wire

Italy . 353 parts In-Stock

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$16.910

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353

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One Stop Electronics

USA . 1,206 parts In-Stock

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$58.050

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UNI Independent Distributors

Spain . 7,602 parts In-Stock

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Corphita

USA . 839 parts In-Stock

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Overview

Unlock the potential of your designs with the BLF1043,135 from NXP Semiconductors! This high-performance N-channel Power FET promises reliability and efficiency, making it an ideal choice for a wide range of applications—from power management to automotive systems. Experience superior thermal performance and enhanced durability, ensuring your projects run seamlessly. With NXP's commitment to quality and innovation, elevate your solutions and stay ahead of the competition!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, making them more efficient in switching applications and suitable for high-speed designs.

Configuration: SINGLE

A single configuration allows for simplified circuit design and compact layouts, making this FET easy to integrate into various applications.

Surface Mount: YES

Surface mount technology enables a smaller footprint and improves thermal performance, which is ideal for modern compact electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide increased versatility in circuit design, allowing them to function efficiently in various applications by only conducting when an appropriate voltage is applied.

Maximum Drain Current (ID): 2.2 A

With a maximum drain current rating of 2.2 A, this FET can handle moderate power loads, making it suitable for many applications including power management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making these FETs well-suited for battery-operated devices and low-power applications.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature of 200 °C indicates robust thermal stability, making this FET suitable for high-temperature environments and applications.

Maximum Drain Current (ID): 2.2 A

This specification being listed twice emphasizes the reliability and consistent performance of the FET under specified conditions.

Technical Specifications

Power Field Effect Transistors (FET) BLF1043,135 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2.2 A

Maximum Drain Current (ID):

2.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Trade Compliance

BLF1043,135 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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