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BLF1822-10,112

NXP Semiconductors

BLF1822-10,112 by NXP Semiconductors

BLF1822-10,112 by NXP Semiconductors is an N-channel enhancement mode FET ideal for high-power applications. It supports a max drain current of 2.2 A and operates up to 200 °C, making it suitable for demanding environments in RF amplification. This MOSFET excels in efficiency and thermal performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

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1k+

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Vyrian

USA . 4,163 parts In-Stock

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Digiode

USA . 2,537 parts In-Stock

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Anansix

USA . 541 parts In-Stock

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Native Components

USA . 171 parts In-Stock

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$0.114

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$0.109

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Northwest PG Solutions

USA . 2,307 parts In-Stock

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$0.125

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Corohmni

South Africa . 653 parts In-Stock

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$1.051

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$0.956

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AZTECH Wire

Italy . 288 parts In-Stock

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$19.270

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One Stop Electronics

USA . 1,643 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,479 parts In-Stock

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Corphita

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UNI Independent Distributors

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Overview

Elevate your designs with the BLF1822-10,112 from NXP Semiconductors, a trusted leader in innovative technology. This premium N-channel power FET delivers reliable performance and exceptional efficiency, ensuring your applications run flawlessly even at high temperatures. Ideal for RF amplification and switch mode power supplies, it provides unmatched value, empowering you to create robust solutions that meet the demands of tomorrow's technology. Choose quality, choose NXP!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient than P-channel types and provide higher electron mobility, making them suitable for high-speed switching applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and is ideal for applications requiring discrete control without the complexity of multiple channels.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive gate-source voltage to conduct, resulting in lower power consumption and enhanced efficiency in ON states.

Maximum Drain Current (Abs) (ID): 2.2 A

A maximum drain current of 2.2 A ensures that the device can handle significant load requirements, making it ideal for various power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high-speed operation, low power consumption, and excellent performance in integration, making it suitable for modern electronic circuits.

Maximum Operating Temperature: 200 °C

A high temperature tolerance of up to 200 °C allows this FET to operate in extreme conditions, increasing reliability and longevity in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) BLF1822-10,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2.2 A

Maximum Drain Current (ID):

2.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF1822-10,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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