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BCP69-25

NXP Semiconductors

BCP69-25 by NXP Semiconductors

PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 40 MHz; Maximum Power Dissipation (Abs): 1.35 W; Maximum Collector Current (IC): 1 A;

Median Price

$0.150

Lifecycle Status

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19

In-Stock Inventory

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Tomark Electronics Ltd

UK . 55 parts In-Stock

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TEDSS.com

USA . 1,646 parts In-Stock

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Tech-Mark Corp

USA . 42,000 parts In-Stock

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Chip Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Bristol Electronics

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Dan-Mar Components

USA . 6,301 parts In-Stock

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Prism Electronics

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Vyrian

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Digiode

USA . 5,575 parts In-Stock

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NPI Materials, Inc.

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Lantek

USA . 3,553 parts In-Stock

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J2 Sourcing AB

Sweden . 3,520 parts In-Stock

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Anansix

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Goldney Electronics S.L.

Spain . 973 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 891 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 321 parts In-Stock

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GES GmbH

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AZTECH Wire

Italy . 7,094 parts In-Stock

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Modulus Dynamics

Lithuania . 17,464 parts In-Stock

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$1.264

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$1.213

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$1.163

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One Stop Electronics

USA . 1,470 parts In-Stock

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Native Components

USA . 2,533 parts In-Stock

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Northwest PG Solutions

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Metaverse IC Inc.

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Cyclops Electronics Ltd (Excess)

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GreenTree Electronics

Israel . 3,553 parts In-Stock

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Kepictronics

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S.R.D Solutions

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Corphita

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Lixinc

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Assy Fe

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Alle Elektronik GmbH

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Supply Digital

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Authorized Procurement Solutions

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Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BCP69-25 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

1 A

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

160

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

IEC-60134

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.5 V

Trade Compliance

BCP69-25 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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