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BB179B,335

NXP Semiconductors

BB179B,335 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Surface Mount: YES; Nominal Diode Capacitance: 18.22 pF; Maximum Repetitive Peak Reverse Voltage: 35 V; JESD-609 Code: e3; Terminal Finish: TIN;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,790 parts In-Stock

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11,790

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Anansix

USA . 2,540 parts In-Stock

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2,540

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Digiode

USA . 2,240 parts In-Stock

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2,240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 572 parts In-Stock

1+ parts

$2.010

100+ parts

-

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572

$2.010

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AZTECH Wire

Italy . 742 parts In-Stock

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$9.100

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742

$9.100

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Native Components

USA . 75 parts In-Stock

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$23.462

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75

$23.462

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Northwest PG Solutions

USA . 939 parts In-Stock

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$25.808

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$23.227

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939

$25.808

$23.227

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Component Stockers USA

USA . 749 parts In-Stock

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$99.990

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749

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,214 parts In-Stock

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Corphita

USA . 3,919 parts In-Stock

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3,919

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UNI Independent Distributors

Spain . 3,760 parts In-Stock

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3,760

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Microchip USA

USA . 257 parts In-Stock

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257

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Technical Specifications

Varactor Diodes BB179B,335 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Nominal Diode Capacitance:

18.22 pF

JESD-609 Code:

e3

Maximum Repetitive Peak Reverse Voltage:

35 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

BB179B,335 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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