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AFT21S232SR3

NXP Semiconductors

AFT21S232SR3 by NXP Semiconductors

AFT21S232SR3 by NXP Semiconductors is an N-CHANNEL RF Power FET with a max power dissipation of 161W. Utilizing METAL-OXIDE SEMICONDUCTOR technology, it operates at a max temperature of 150°C and can withstand peak reflow temp of 260°C for up to 40s. Ideal for high-power RF applications in various industries.

Median Price

$78.415

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 148 parts In-Stock

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$48.860

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Rochester

USA . 1,238 parts In-Stock

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$107.970

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$96.600

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$90.920

1,238

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$96.600

$90.920

Distributors (In-Stock)

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Digiode

USA . 3,792 parts In-Stock

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$77.358

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3,792

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Vyrian

USA . 981 parts In-Stock

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$81.430

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981

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Anansix

USA . 1,516 parts In-Stock

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1,516

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Flip Electronics

USA . 500 parts In-Stock

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500

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Distributors (Availability)

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Native Components

USA . 641 parts In-Stock

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$1.319

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641

$1.319

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Northwest PG Solutions

USA . 969 parts In-Stock

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$1.451

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969

$1.451

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One Stop Electronics

USA . 254 parts In-Stock

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$69.220

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254

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Corphita

USA . 1,055 parts In-Stock

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$73.287

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$73.287

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UNI Independent Distributors

Spain . 7,811 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

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Overview

Unlock the power of next-generation RF technology with the AFT21S232SR3 from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality RF Power Field Effect Transistors that exceed expectations. Ideal for a wide range of applications, this N-CHANNEL FET offers unmatched performance and reliability. Experience the value and benefits of cutting-edge semiconductor technology with the AFT21S232SR3, providing customers with the competitive edge they need to succeed in today's fast-paced market.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their high electron mobility and fast switching speeds, making this product suitable for high frequency applications.

Configuration: SINGLE

SINGLE configuration simplifies the design and integration of the transistor into circuits, making it easier to work with for engineers and designers.

Maximum Power Dissipation (Abs): 161 W

With a high maximum power dissipation of 161 W, this transistor can handle high power levels without overheating, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers good noise performance, high input impedance, and low power consumption, making this transistor efficient and reliable.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this transistor can operate in harsh environments without losing performance, ensuring durability and reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for easy and reliable soldering during manufacturing, ensuring proper connections and long-term stability.

Technical Specifications

RF Power Field Effect Transistors (FET) AFT21S232SR3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

AFT21S232SR3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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