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AFT21H350W03SR6

NXP Semiconductors

AFT21H350W03SR6 by NXP Semiconductors

N-CHANNEL; Configuration: SINGLE; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; No. of Elements: 1; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

Median Price

$204.990

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 352 parts In-Stock

1+ parts

$139.310

100+ parts

-

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352

$139.310

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Rochester

USA . 450 parts In-Stock

1+ parts

$160.660

100+ parts

$151.020

1k+ parts

$141.380

10k+ parts

-

450

$160.660

$151.020

$141.380

-

Richardson RFPD

USA . 53 parts In-Stock

1+ parts

$204.990

100+ parts

$185.100

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-

10k+ parts

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53

$204.990

$185.100

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Chip1Stop

Japan . 53 parts In-Stock

1+ parts

$276.000

100+ parts

$272.000

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53

$276.000

$272.000

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DigiKey

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$213.950

1k+ parts

$213.950

10k+ parts

$213.950

300

-

$213.950

$213.950

$213.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,365 parts In-Stock

1+ parts

$177.669

100+ parts

-

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2,365

$177.669

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Vyrian

USA . 3,025 parts In-Stock

1+ parts

$187.020

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3,025

$187.020

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Anansix

USA . 1,737 parts In-Stock

1+ parts

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1,737

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DigiKey Marketplace

USA . 150 parts In-Stock

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150

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Flip Electronics

USA . 150 parts In-Stock

1+ parts

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 947 parts In-Stock

1+ parts

$0.115

100+ parts

-

1k+ parts

-

10k+ parts

$0.110

947

$0.115

-

-

$0.110

Northwest PG Solutions

USA . 1,745 parts In-Stock

1+ parts

$0.127

100+ parts

-

1k+ parts

-

10k+ parts

$0.112

1,745

$0.127

-

-

$0.112

Corohmni

South Africa . 14 parts In-Stock

1+ parts

$1.423

100+ parts

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14

$1.423

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$2.326

100+ parts

$2.117

1k+ parts

$1.907

10k+ parts

-

300

$2.326

$2.117

$1.907

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Corphita

USA . 2,690 parts In-Stock

1+ parts

$168.318

100+ parts

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2,690

$168.318

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Continental Prestige Electronics

USA . 150 parts In-Stock

1+ parts

$249.380

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150

$249.380

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Microchip USA

USA . 356 parts In-Stock

1+ parts

$299.220

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356

$299.220

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UNI Independent Distributors

Spain . 2,652 parts In-Stock

1+ parts

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2,652

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 13 parts In-Stock

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13

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Technical Specifications

RF Power Field Effect Transistors (FET) AFT21H350W03SR6 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

AFT21H350W03SR6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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