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AFT18HW355SR5

NXP Semiconductors

AFT18HW355SR5 by NXP Semiconductors

NXP Semiconductors AFT18HW355SR5 is an N-CHANNEL RF Power FET with METAL-OXIDE SEMICONDUCTOR tech. It operates up to 125°C, withstands peak reflow temp of 260°C for 40s. Ideal for high-frequency applications in industries like telecommunications and radar systems.

Median Price

$267.212

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 50 parts In-Stock

1+ parts

$227.410

100+ parts

$213.770

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$200.120

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$200.120

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DigiKey

USA . 50 parts In-Stock

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$284.260

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Verical

USA . 50 parts In-Stock

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$267.212

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$250.150

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$250.150

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Distributors (In-Stock)

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Digiode

USA . 4,901 parts In-Stock

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$251.474

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Vyrian

USA . 3,210 parts In-Stock

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Anansix

USA . 311 parts In-Stock

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DigiKey Marketplace

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EPE Components Inc.

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Bristol Electronics

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Distributors (Availability)

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Native Components

USA . 501 parts In-Stock

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$0.300

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$0.288

501

$0.300

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$0.288

Northwest PG Solutions

USA . 1,402 parts In-Stock

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$0.330

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$0.291

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$0.330

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One Stop Electronics

USA . 4 parts In-Stock

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$225.000

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Corphita

USA . 928 parts In-Stock

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$238.239

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Component Stockers USA

USA . 71 parts In-Stock

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$272.180

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Continental Prestige Electronics

USA . 50 parts In-Stock

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$317.650

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QUARKTWIN TECHNOLOGY LTD

USA . 22,285 parts In-Stock

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Microchip USA

USA . 8,990 parts In-Stock

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UNI Independent Distributors

Spain . 7,196 parts In-Stock

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Overview

Experience the cutting-edge innovation of NXP Semiconductors with the AFT18HW355SR5 RF Power Field Effect Transistor. This N-CHANNEL FET offers unparalleled performance and reliability, making it ideal for a wide range of applications. From wireless communication to radar systems, this product delivers exceptional value by maximizing efficiency and power output. Trust NXP Semiconductors to provide you with the quality and excellence you need for your next project.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically offer lower on-state resistance and higher electron mobility, making them suitable for high power applications.

Configuration: SINGLE

Single configuration FETs simplify circuit design and reduce the chances of thermal runaway, improving overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance at high frequencies and high power levels, making it ideal for RF power applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this FET can withstand high temperatures, ensuring stable and reliable operation in demanding environments.

Maximum Time At Peak Reflow Temperature (s): 40

The FET can handle peak reflow temperatures for up to 40 seconds, allowing for efficient assembly processes without compromising the component's integrity.

Peak Reflow Temperature °C: 260

The FET can withstand peak reflow temperatures of 260°C, making it suitable for high-temperature soldering processes and ensuring robust performance during assembly.

Technical Specifications

RF Power Field Effect Transistors (FET) AFT18HW355SR5 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

AFT18HW355SR5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.40

SB

8541.29.00.40

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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