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A7102CHUK/T0BC2VAZ

NXP Semiconductors

A7102CHUK/T0BC2VAZ by NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR;

Median Price

$3.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,646 parts In-Stock

1+ parts

$3.620

100+ parts

$2.248

1k+ parts

$2.067

10k+ parts

-

1,646

$3.620

$2.248

$2.067

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,721 parts In-Stock

1+ parts

$3.439

100+ parts

-

1k+ parts

-

10k+ parts

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4,721

$3.439

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-

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Vyrian

USA . 190 parts In-Stock

1+ parts

$3.620

100+ parts

-

1k+ parts

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190

$3.620

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-

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Anansix

USA . 1,609 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,609

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,584 parts In-Stock

1+ parts

$3.258

100+ parts

-

1k+ parts

-

10k+ parts

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3,584

$3.258

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-

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Native Components

USA . 837 parts In-Stock

1+ parts

$6.265

100+ parts

-

1k+ parts

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10k+ parts

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837

$6.265

-

-

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Microchip USA

USA . 279 parts In-Stock

1+ parts

$6.821

100+ parts

-

1k+ parts

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279

$6.821

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-

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Corohmni

South Africa . 949 parts In-Stock

1+ parts

$86.429

100+ parts

-

1k+ parts

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949

$86.429

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UNI Independent Distributors

Spain . 1,396 parts In-Stock

1+ parts

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1,396

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Northwest PG Solutions

USA . 881 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$6.139

10k+ parts

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881

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$6.139

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs A7102CHUK/T0BC2VAZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

JESD-30 Code:

R-PBGA-B12

Length:

2.06 mm

No. of Terminals:

12

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.65 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.018 mm

Peripheral IC Type:

Trade Compliance

A7102CHUK/T0BC2VAZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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