Loading...

74LVC1G04GW,165

NXP Semiconductors

74LVC1G04GW,165 by NXP Semiconductors

NXP Semiconductors' 74LVC1G04GW,165 is a CMOS Logic Gate with 5.5 ns Propagation Delay and 50 pF Load Capacitance. It operates at a Nominal Voltage of 3.3V, suitable for automotive applications due to its small size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 116,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116,000

-

-

-

-

Vyrian

USA . 8,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,702

-

-

-

-

Digiode

USA . 2,849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,849

-

-

-

-

Anansix

USA . 2,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,330

-

-

-

-

VNN

France . 2,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,019

-

-

-

-

Nova Conductors

Japan . 21 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,428 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

1k+ parts

$7.760

10k+ parts

-

1,428

$8.000

$7.800

$7.760

-

AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$18.795

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$18.795

-

-

-

Corohmni

South Africa . 607 parts In-Stock

1+ parts

$27.897

100+ parts

-

1k+ parts

-

10k+ parts

-

607

$27.897

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$30.522

100+ parts

$28.996

1k+ parts

$28.996

10k+ parts

-

2,500

$30.522

$28.996

$28.996

-

Aztec Data Supply Inc.

USA . 214 parts In-Stock

1+ parts

$33.300

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$33.300

-

-

-

One Stop Electronics

USA . 853 parts In-Stock

1+ parts

$47.000

100+ parts

-

1k+ parts

-

10k+ parts

-

853

$47.000

-

-

-

Ampacity Inc.

Singapore . 451 parts In-Stock

1+ parts

$61.000

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$61.000

-

-

-

UNI Independent Distributors

Spain . 6,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,756

-

-

-

-

Argo Parts USA

USA . 4,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,525

-

-

-

-

Continental Prestige Electronics

USA . 3,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,606

-

-

-

-

Corphita

USA . 818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

818

-

-

-

-

Microchip USA

USA . 177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

177

-

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Enhance your electronic projects with the NXP Semiconductors 74LVC1G04GW,165 Logic Gates. Designed with precision and reliability in mind, this compact and versatile component offers fast propagation delay and low power consumption, making it ideal for a wide range of applications. Whether you're working on automotive electronics or IoT devices, this high-quality product guarantees seamless performance and efficiency. Trust NXP Semiconductors to deliver top-notch technology that meets your needs and exceeds your expectations. Upgrade your designs today with the 74LVC1G04GW,165 Logic Gates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, perfect for various applications.

Propagation Delay at Nominal Supply: 5.5 ns

A low propagation delay ensures fast operation, making this product ideal for high-speed logic applications.

Surface Mount: YES

Surface mount capability provides easy installation and saves space on the PCB, making it convenient for compact designs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, making this product suitable for designs with limited space.

Nominal Supply Voltage (Vsup): 3.3V

Operating at a common supply voltage simplifies integration into existing systems, increasing compatibility.

Load Capacitance (CL): 50 pF

This low load capacitance helps reduce signal distortion, ensuring reliable and accurate logic gate operations.

Power Supplies (V): 3.3 V

This voltage compatibility with standard power supplies offers ease of use and integration into various systems.

No. of Terminals: 5

The compact design with a minimal number of terminals simplifies PCB layout and reduces wiring complexity.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style saves PCB space and offers better thermal performance, improving overall system efficiency.

Maximum I (ol): 24 Amp

With a high output current capability, this product can drive multiple loads without external buffering, simplifying the design.

Propagation Delay (tpd): 9.5 ns

The short propagation delay enables quick signal processing, making it suitable for time-critical applications.

Maximum Operating Temperature: 125 °C

Able to withstand high temperatures, this product is reliable in harsh environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable operation in both cold and hot environments, increasing versatility.

Terminal Finish: Tin (Sn)

The tin finish provides good solderability, ensuring easy and reliable connections during assembly.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and enable efficient use of board space.

Maximum Seated Height: 1.1 mm

With a low profile, this product can be used in compact designs without compromising on performance.

Width: 1.25 mm

The narrow width saves space on the PCB, facilitating dense designs with multiple components.

Minimum Supply Voltage (Vsup): 1.65 V

This low minimum supply voltage allows for operation in low-power systems and extends battery life in portable devices.

Maximum Time at Peak Reflow Temperature: 30 s

This maximum time limit ensures safe assembly during reflow soldering, protecting the product from heat damage.

Peak Reflow Temperature: 260 C

With a high peak reflow temperature, this product withstands the soldering process without degradation, ensuring long-term reliability.

Length: 2.05 mm

The compact length of the package saves space on the PCB, allowing for more efficient designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent requirements for reliability in automotive environments.

Technology: CMOS

CMOS technology offers low power consumption, making this product energy-efficient and suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easy PCB mounting and removal, simplifying maintenance and repair.

Packing Method: TR

This packing method ensures convenient handling and storage, protecting the product during transportation and assembly.

Terminal Pitch: 0.65 mm

The small terminal pitch saves space on the PCB, enabling high-density layouts with multiple components.

Maximum Supply Voltage (Vsup): 5.5 V

This high maximum supply voltage tolerance ensures the product's compatibility with a wide range of power sources, increasing versatility.

Technical Specifications

Logic Gates 74LVC1G04GW,165 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G04GW,165 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20