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74LVC16245ABX,518

NXP Semiconductors

74LVC16245ABX,518 by NXP Semiconductors

74LVC16245ABX,518 from NXP is a CMOS bus driver with an 8-bit capacity and a propagation delay of just 6 ns. It operates at a nominal voltage of 3.3V and supports bidirectional data flow. Ideal for automotive applications, it features robust temperature ratings from -40 °C to 125 °C.

Median Price

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Lifecycle Status

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4

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Chip Stock

USA . 161,000 parts In-Stock

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Vyrian

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Digiode

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Anansix

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Native Components

USA . 924 parts In-Stock

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Northwest PG Solutions

USA . 227 parts In-Stock

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Andel Nordic

Denmark . 1,287 parts In-Stock

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AZTECH Wire

Italy . 1,145 parts In-Stock

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One Stop Electronics

USA . 806 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock superior performance with the 74LVC16245ABX from NXP Semiconductors, a leader in innovation and quality. This robust bus driver and transceiver excels in demanding applications, offering bidirectional data transfer at lightning-fast speeds while maintaining exceptional reliability. Designed for automotive environments, it withstands extreme temperatures and operates efficiently at low power. Elevate your designs and ensure seamless connectivity with a solution that combines cutting-edge technology and unmatched durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust protection and longevity of the component in various operating environments.

Propagation Delay at Nominal Supply: 6 ns

With a low propagation delay, this product ensures fast signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuit boards.

No. of Functions: 2

Two functional capabilities provide versatility, allowing for more complex operations without the need for multiple components.

No. of Bits: 8

An 8-bit configuration adequate for a wide range of digital data applications, ensuring efficient data handling.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a low supply voltage is energy-efficient, reducing overall power consumption in devices.

Load Capacitance (CL): 50 pF

A low load capacitance enhances signal integrity and allows for faster switching speeds.

Power Supplies (V): 3.3

Compatible with commonly used low-voltage power supplies, facilitating easy integration into existing systems.

No. of Terminals: 60

A higher number of terminals provides more connections and functionality options, enabling complex circuit designs.

Maximum I (ol): 24 Amp

A maximum output current capability of 24 Amps allows this product to drive heavier loads, increasing its versatility in applications.

Maximum Operating Temperature: 125 °C

A high operating temperature rating ensures reliability in extreme conditions, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics facilitate bus sharing and reduce unnecessary power drain, enhancing efficiency.

Minimum Operating Temperature: -40 °C

Low operating temperature range enables reliable performance in cold environments, essential for automotive applications.

Output Polarity: TRUE

True output polarity is standard and ensures compatibility with a wide range of logic systems.

Maximum Time at Peak Reflow Temperature (s): 30

A reasonable maximum time at peak reflow temperature helps prevent thermal damage during manufacturing.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature rating indicates the component's ability to withstand soldering processes without damage.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and compliance with rigorous industry standards.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered applications.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability provides greater flexibility for data transfer in both directions.

Control Type: COMMON CONTROL

Common control simplifies operation and enhances usability in designs requiring multiple devices.

Moisture Sensitivity Level (MSL): 2

An MSL rating of 2 indicates moderate sensitivity to moisture, allowing reasonable handling and storage conditions.

Technical Specifications

Bus Driver & Transceivers 74LVC16245ABX,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Load Capacitance (CL):

50 pF

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

60

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SLGA60,8X12,20

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

74LVC16245ABX,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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