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74HCT27N,652

NXP Semiconductors

74HCT27N,652 by NXP Semiconductors

74HCT27N,652 by NXP Semiconductors is a CMOS Logic Gate with 3 functions and inputs. It operates at a supply voltage of 5V, with a propagation delay of 26ns. Ideal for automotive applications due to its nickel palladium gold finish and wide temperature range from -40 to 125°C.

Median Price

$0.619

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,594 parts In-Stock

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-

100+ parts

$0.619

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$0.513

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$0.458

13,594

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$0.619

$0.513

$0.458

Verical

USA . 5,075 parts In-Stock

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$0.642

10k+ parts

$0.572

5,075

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$0.642

$0.572

Chip1Stop

Japan . 70 parts In-Stock

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$0.202

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70

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$0.202

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Distributors (In-Stock)

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Digiode

USA . 3,689 parts In-Stock

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$0.247

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Vyrian

USA . 8,304 parts In-Stock

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Anansix

USA . 1,160 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,444 parts In-Stock

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$0.234

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$0.234

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Component Stockers USA

USA . 35,793 parts In-Stock

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$0.260

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$0.250

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$0.220

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$0.220

35,793

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$0.250

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$0.220

Microchip USA

USA . 340 parts In-Stock

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$0.495

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340

$0.495

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AZTECH Wire

Italy . 1,141 parts In-Stock

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$18.000

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$18.000

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Continental Prestige Electronics

USA . 13,594 parts In-Stock

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$0.310

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UNI Independent Distributors

Spain . 2,374 parts In-Stock

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Northwest PG Solutions

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Native Components

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Overview

Unlock the power of reliable logic gates with the 74HCT27N,652 from NXP Semiconductors. Designed with precision and quality in mind, this product offers a seamless experience for a wide range of applications. With fast propagation delay and low power consumption, this logic gate ensures optimal performance while maximizing efficiency. Trust NXP Semiconductors to deliver innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the 74HCT27N,652 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product robust and easy to handle.

Propagation Delay At Nominal Supply: 26 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes integration into existing circuits easier.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable performance of the logic gates.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the logic gates.

Technical Specifications

Logic Gates 74HCT27N,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HCT27N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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