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74HCT153N,652

NXP Semiconductors

74HCT153N,652 by NXP Semiconductors

MULTIPLEXER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$0.971

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,671 parts In-Stock

1+ parts

-

100+ parts

$0.953

1k+ parts

$0.791

10k+ parts

$0.705

10,671

-

$0.953

$0.791

$0.705

Verical

USA . 5,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.989

10k+ parts

$0.882

5,650

-

-

$0.989

$0.882

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,287 parts In-Stock

1+ parts

$0.381

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-

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1,287

$0.381

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Vyrian

USA . 4,289 parts In-Stock

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4,289

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Anansix

USA . 391 parts In-Stock

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391

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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60

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Distributors (Availability)

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Corphita

USA . 1,854 parts In-Stock

1+ parts

$0.361

100+ parts

-

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1,854

$0.361

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Microchip USA

USA . 183 parts In-Stock

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$0.578

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183

$0.578

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Native Components

USA . 988 parts In-Stock

1+ parts

$11.257

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988

$11.257

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Northwest PG Solutions

USA . 905 parts In-Stock

1+ parts

$12.383

100+ parts

$11.145

1k+ parts

-

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905

$12.383

$11.145

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AZTECH Wire

Italy . 297 parts In-Stock

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$12.860

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297

$12.860

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Continental Prestige Electronics

USA . 10,671 parts In-Stock

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100+ parts

$0.480

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10,671

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$0.480

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QUARKTWIN TECHNOLOGY LTD

USA . 8,011 parts In-Stock

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8,011

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UNI Independent Distributors

Spain . 7,976 parts In-Stock

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Perfect Parts

USA . 123 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 60 parts In-Stock

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60

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Glotronic Ltd.

UK . 48 parts In-Stock

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Technical Specifications

Multiplexer & Demultiplexer 74HCT153N,652 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

51 ns

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HCT153N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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