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74HCT14N,652

NXP Semiconductors

74HCT14N,652 by NXP Semiconductors

INVERTER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$2.450

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Forefront Electronics and Design

USA . 10 parts In-Stock

1+ parts

$2.450

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10

$2.450

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Sensible Micro Corp

USA . 34,516 parts In-Stock

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Vyrian

USA . 6,369 parts In-Stock

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6,369

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Anansix

USA . 734 parts In-Stock

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734

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Halfin

Belgium . 300 parts In-Stock

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300

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Digiode

USA . 281 parts In-Stock

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281

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A&K Electronics

USA . 24 parts In-Stock

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24

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Rotakorn

Sweden . 24 parts In-Stock

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24

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Bristol Electronics

USA . 24 parts In-Stock

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24

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EMSNET

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 220 parts In-Stock

1+ parts

$0.603

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220

$0.603

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AZTECH Wire

Italy . 963 parts In-Stock

1+ parts

$11.020

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963

$11.020

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Native Components

USA . 832 parts In-Stock

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$13.901

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832

$13.901

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Northwest PG Solutions

USA . 1,364 parts In-Stock

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$15.292

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$13.762

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1,364

$15.292

$13.762

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One Stop Electronics

USA . 1,605 parts In-Stock

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$54.000

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1,605

$54.000

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UNI Independent Distributors

Spain . 7,756 parts In-Stock

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Perfect Parts

USA . 3,250 parts In-Stock

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Corphita

USA . 3,231 parts In-Stock

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Technical Specifications

Logic Gates 74HCT14N,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

51 ns

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

74HCT14N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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