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74AHC257D-Q100

NXP Semiconductors

74AHC257D-Q100 by NXP Semiconductors

74AHC257D-Q100 by NXP is a CMOS multiplexer with 4 functions and operates b/w -40 °C to 125 °C. It features a 16-terminal, dual terminal position design with a propagation delay of just 16 ns. Ideal for automotive applications, it supports supply voltages from 2V to 5.5V.

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Vyrian

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Digiode

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Anansix

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Northwest PG Solutions

USA . 3,508 parts In-Stock

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Native Components

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AZTECH Wire

Italy . 6,860 parts In-Stock

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One Stop Electronics

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UNI Independent Distributors

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Corphita

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Supply Digital

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Overview

Elevate your designs with the 74AHC257D-Q100 from NXP Semiconductors, a pinnacle of quality and reliability in multiplexing solutions. Crafted under stringent AEC-Q100 standards, this automotive-grade multiplexer ensures exceptional performance even in extreme conditions. With its compact footprint and efficient signal handling, it seamlessly integrates into diverse applications, offering customers superior value, enhanced functionality, and peace of mind for their projects. Trust NXP for excellence that drives innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental stress, making this product suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact designs and enhances assembly efficiency, making it a great choice for space-constrained applications.

No. of Functions: 4

Having four functions increases versatility, allowing for multiple signal routing options in a single device, which saves board space and costs.

Screening Level: AEC-Q100

Compliance with AEC-Q100 signals high reliability and robustness for automotive applications, ensuring consistent performance in harsh conditions.

No. of Inputs: 2

With two inputs, this multiplexer/demultiplexer offers a simple and effective signal management solution for various applications.

Package Shape: RECTANGULAR

The rectangular shape is optimal for easy layout in printed circuit boards, facilitating efficient design and integration.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common requirement in many electronic systems, ensuring compatibility with a wide range of components.

No. of Terminals: 16

A total of 16 terminals allows for ample connection options, providing flexibility for various circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it ideal for high-density applications, promoting space efficiency on circuit boards.

Propagation Delay (tpd): 16 ns

A low propagation delay of 16 ns enhances performance in high-speed applications, ensuring rapid signal processing.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C makes this device suitable for high-temperature automotive environments.

Output Characteristics: 3-STATE

3-state output characteristics allow for easy sharing of data lines, increasing system flexibility and efficiency in communication.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature ensures reliability in extreme cold conditions, ideal for automotive and industrial applications.

Terminal Position: DUAL

Dual terminal positioning supports easy soldering and improves electrical performance in circuit connections.

Maximum Seated Height: 1.75 mm

A low maximum seated height contributes to a compact profile, which is crucial for modern electronic designs.

Width: 3.9 mm

The compact width allows for tight spacing on PCBs, maximizing layout efficiency and enabling high-density applications.

Output Polarity: TRUE

True output polarity simplifies design considerations and enhances compatibility with various logic families.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V allows for flexibility in lower voltage applications, broadening the potential use cases.

Length: 9.9 mm

A short length of 9.9 mm supports space-saving designs while maintaining robust performance in various applications.

Temperature Grade: AUTOMOTIVE

This temperature grade indicates that the product meets stringent automotive standards, ensuring reliability in vehicle applications.

Technology: CMOS

CMOS technology enhances power efficiency and allows for high-speed operations, making it a prime choice for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and ensures reliable mechanical properties, crucial for robust electronic assemblies.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances compactness and ease of handling, enhancing assembly processes and PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a flexible operating range, accommodating various system requirements without compromising performance.

Technical Specifications

Multiplexer & Demultiplexer 74AHC257D-Q100 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

16 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74AHC257D-Q100 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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