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74AHC157PW,118

NXP Semiconductors

74AHC157PW,118 by NXP Semiconductors

MULTIPLEXER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.265

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$0.090

100+ parts

-

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10

$0.090

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DigiKey

USA . 3,259 parts In-Stock

1+ parts

$0.290

100+ parts

$0.152

1k+ parts

$0.127

10k+ parts

$0.115

3,259

$0.290

$0.152

$0.127

$0.115

Mouser Electronics

USA . 3,045 parts In-Stock

1+ parts

$0.290

100+ parts

$0.141

1k+ parts

$0.128

10k+ parts

$0.112

3,045

$0.290

$0.141

$0.128

$0.112

Rochester

USA . 5,010 parts In-Stock

1+ parts

-

100+ parts

$0.265

1k+ parts

$0.220

10k+ parts

$0.196

5,010

-

$0.265

$0.220

$0.196

Verical

USA . 5,000 parts In-Stock

1+ parts

-

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$0.245

5,000

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$0.245

Chip1Stop

Japan . 10 parts In-Stock

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10

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Distributors (In-Stock)

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Digiode

USA . 4,480 parts In-Stock

1+ parts

$0.095

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4,480

$0.095

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Component Electronics Inc.

Canada . 2,499 parts In-Stock

1+ parts

$0.500

100+ parts

$0.380

1k+ parts

$0.330

10k+ parts

-

2,499

$0.500

$0.380

$0.330

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Chip Stock

USA . 165,000 parts In-Stock

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Vyrian

USA . 2,830 parts In-Stock

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Anansix

USA . 1,525 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,835 parts In-Stock

1+ parts

$0.090

100+ parts

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1,835

$0.090

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AZTECH Wire

Italy . 7,594 parts In-Stock

1+ parts

$0.120

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7,594

$0.120

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Microchip USA

USA . 6,589 parts In-Stock

1+ parts

$1.022

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6,589

$1.022

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Northwest PG Solutions

USA . 3,718 parts In-Stock

1+ parts

$1.809

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3,718

$1.809

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Native Components

USA . 311 parts In-Stock

1+ parts

$7.141

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311

$7.141

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Perfect Parts

USA . 22,400 parts In-Stock

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22,400

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UNI Independent Distributors

Spain . 8,257 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Continental Prestige Electronics

USA . 5,000 parts In-Stock

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$0.140

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5,000

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$0.140

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Supply Digital

USA . 2,781 parts In-Stock

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2,781

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Technical Specifications

Multiplexer & Demultiplexer 74AHC157PW,118 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

21.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74AHC157PW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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