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74AHC157PW

Philips Semiconductors

74AHC157PW by Philips Semiconductors

MULTIPLEXER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,911 parts In-Stock

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Digiode

USA . 1,952 parts In-Stock

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Anansix

USA . 1,522 parts In-Stock

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Native Components

USA . 1,073 parts In-Stock

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$1.156

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AZTECH Wire

Italy . 3,937 parts In-Stock

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One Stop Electronics

USA . 1,054 parts In-Stock

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UNI Independent Distributors

Spain . 3,742 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 2,503 parts In-Stock

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Supply Digital

USA . 2,284 parts In-Stock

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Kepictronics

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Perfect Parts

USA . 125 parts In-Stock

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Technical Specifications

Multiplexer & Demultiplexer 74AHC157PW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74AHC157PW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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