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74ABT841DB,118

NXP Semiconductors

74ABT841DB,118 by NXP Semiconductors

NXP Semiconductors' 74ABT841DB,118 is a 10-bit bus driver with 6.2 ns propagation delay at 5V supply voltage. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max power supply current of 38 mA. Ideal for applications requiring fast signal transmission and low power consumption in various electronic systems.

Median Price

$0.551

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$0.541

1k+ parts

$0.449

10k+ parts

$0.400

12,000

-

$0.541

$0.449

$0.400

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.561

10k+ parts

$0.500

12,000

-

-

$0.561

$0.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,137 parts In-Stock

1+ parts

$0.217

100+ parts

-

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-

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-

3,137

$0.217

-

-

-

Vyrian

USA . 7,062 parts In-Stock

1+ parts

-

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-

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7,062

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Anansix

USA . 475 parts In-Stock

1+ parts

-

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475

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,206 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

3,206

$0.205

-

-

-

Andel Nordic

Denmark . 394 parts In-Stock

1+ parts

$0.723

100+ parts

-

1k+ parts

$0.695

10k+ parts

$0.695

394

$0.723

-

$0.695

$0.695

Microchip USA

USA . 224 parts In-Stock

1+ parts

$13.870

100+ parts

$13.870

1k+ parts

$13.870

10k+ parts

$13.870

224

$13.870

$13.870

$13.870

$13.870

AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$19.180

100+ parts

-

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-

10k+ parts

-

403

$19.180

-

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Continental Prestige Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.270

10k+ parts

-

12,000

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-

$0.270

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QUARKTWIN TECHNOLOGY LTD

USA . 8,205 parts In-Stock

1+ parts

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8,205

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UNI Independent Distributors

Spain . 4,962 parts In-Stock

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4,962

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Northwest PG Solutions

USA . 825 parts In-Stock

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825

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Native Components

USA . 164 parts In-Stock

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164

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Overview

Discover the unparalleled quality and reliability of the 74ABT841DB,118 by NXP Semiconductors, a leading manufacturer in the industry. As a top-of-the-line Bus Driver & Transceiver, this product offers seamless communication solutions for a variety of applications. With fast propagation delays and low power consumption, customers can expect efficient performance and cost-effective operation. Experience the value and benefits of this high-quality semiconductor that delivers exceptional results, making it the ideal choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to damage, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 6.2 ns

Low Propagation Delay ensures fast data transmission and efficient performance.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the PCB.

No. of Bits: 10

Having 10 bits allows for a wide range of data to be transferred, making the product versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage simplifies integration into existing systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient signal transmission and better overall performance.

Output Characteristics: 3-STATE

3-STATE output provides flexibility and control in managing signal flow.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Technical Specifications

Bus Driver & Transceivers 74ABT841DB,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION; WITH POWER-UP RESET

Family:

ABT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74ABT841DB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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