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74ABT573AD,112

NXP Semiconductors

74ABT573AD,112 by NXP Semiconductors

NXP Semiconductors' 74ABT573AD,112 is an 8-bit bus driver with a propagation delay of 4.7 ns at 5V supply voltage. It features a small outline package and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring fast signal transmission and low power consumption.

Median Price

$0.498

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,252 parts In-Stock

1+ parts

-

100+ parts

$0.489

1k+ parts

$0.406

10k+ parts

$0.362

3,252

-

$0.489

$0.406

$0.362

Verical

USA . 1,301 parts In-Stock

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$0.508

10k+ parts

$0.453

1,301

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$0.508

$0.453

Distributors (In-Stock)

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Digiode

USA . 3,651 parts In-Stock

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$0.196

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Vyrian

USA . 4,937 parts In-Stock

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Sensible Micro Corp

USA . 4,000 parts In-Stock

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Anansix

USA . 703 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 37 parts In-Stock

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Inventory MP

USA . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,948 parts In-Stock

1+ parts

$0.185

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Native Components

USA . 576 parts In-Stock

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$0.650

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Northwest PG Solutions

USA . 1,092 parts In-Stock

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$0.715

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$0.715

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Andel Nordic

Denmark . 4,351 parts In-Stock

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$1.942

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$1.865

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$1.865

4,351

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$1.865

Microchip USA

USA . 171 parts In-Stock

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$9.420

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$9.420

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$9.420

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$9.420

171

$9.420

$9.420

$9.420

$9.420

AZTECH Wire

Italy . 696 parts In-Stock

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$13.050

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QUARKTWIN TECHNOLOGY LTD

USA . 8,992 parts In-Stock

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UNI Independent Distributors

Spain . 7,149 parts In-Stock

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Continental Prestige Electronics

USA . 3,252 parts In-Stock

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$0.247

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Overview

Enhance your electronic designs with the reliable 74ABT573AD,112 from NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and performance. This bus driver & transceiver is versatile and perfect for various applications. With a low propagation delay, high output current, and a wide operating temperature range, this product offers exceptional value and benefits to customers. Trust NXP Semiconductors for superior technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in transportation vehicles like buses.

Propagation Delay At Nominal Supply: 5.3 ns

The low propagation delay ensures fast and efficient communication within the bus driver system, leading to quick response times.

Surface Mount: YES

Being surface mountable, the product is easy to install and saves space on the PCB, making it suitable for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes the product compatible with standard electronic systems and power sources.

Load Capacitance (CL): 50 pF

With a low load capacitance, the product can drive capacitive loads efficiently, ensuring reliable signal transmission in bus driver applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions that may be encountered in bus operations.

Technology: BICMOS

Utilizing BICMOS technology ensures a balance between high-speed performance and low power consumption, making the product energy efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74ABT573AD,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

BROADSIDE VERSION OF 373

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

5.3 ns

Propagation Delay (tpd):

4.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74ABT573AD,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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