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74ABT16373BDGG,112

NXP Semiconductors

74ABT16373BDGG,112 by NXP Semiconductors

74ABT16373BDGG,112 by NXP Semiconductors is a bus driver & transceiver with 8 bits and a propagation delay of 4.4 ns. It operates at a nominal voltage of 5V and has a small outline package style. This component is commonly used in industrial applications requiring fast data transmission.

Median Price

$0.944

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,365 parts In-Stock

1+ parts

-

100+ parts

$0.927

1k+ parts

$0.770

10k+ parts

$0.686

1,365

-

$0.927

$0.770

$0.686

Verical

USA . 1,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.962

10k+ parts

$0.858

1,365

-

-

$0.962

$0.858

Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.366

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-

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15

$0.366

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Digiode

USA . 4,230 parts In-Stock

1+ parts

$0.370

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4,230

$0.370

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Vyrian

USA . 4,173 parts In-Stock

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4,173

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VNN

France . 3,854 parts In-Stock

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3,854

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Anansix

USA . 689 parts In-Stock

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689

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Corphita

USA . 2,523 parts In-Stock

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$0.351

100+ parts

-

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2,523

$0.351

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Netroflash

USA . 500 parts In-Stock

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$0.366

100+ parts

$0.359

1k+ parts

-

10k+ parts

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500

$0.366

$0.359

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Ampacity Inc.

Singapore . 1,085 parts In-Stock

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$0.720

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1,085

$0.720

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Andel Nordic

Denmark . 2,114 parts In-Stock

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$8.043

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$7.721

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$7.721

2,114

$8.043

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$7.721

AZTECH Wire

Italy . 1,182 parts In-Stock

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$14.910

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1,182

$14.910

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Microchip USA

USA . 144 parts In-Stock

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$18.160

100+ parts

$18.160

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$18.160

10k+ parts

$18.160

144

$18.160

$18.160

$18.160

$18.160

Advanced Electronics

New Zealand . 87 parts In-Stock

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$30.223

100+ parts

$27.503

1k+ parts

$24.783

10k+ parts

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87

$30.223

$27.503

$24.783

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UNI Independent Distributors

Spain . 5,372 parts In-Stock

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5,372

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Continental Prestige Electronics

USA . 1,365 parts In-Stock

1+ parts

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100+ parts

$0.470

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1,365

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$0.470

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Overview

Experience seamless data transfer with the 74ABT16373BDGG,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures top-notch quality and reliability. This bus driver and transceiver is designed to optimize performance, making it ideal for various applications. With its 3-STATE output characteristics and true output polarity, this product offers unmatched versatility and flexibility. Whether you're working on industrial projects or high-speed communication systems, the 74ABT16373BDGG,112 delivers exceptional value and benefits. Say goodbye to delays and hello to efficient data transmission. Trust NXP Semiconductors for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy as the package body material ensures durability and resistance to external impacts, making it a reliable choice for bus drivers and transceivers.

Propagation Delay At Nominal Supply: 4.4 ns

With a low propagation delay of 4.4 ns, this product allows for fast and efficient data transmission, enhancing its performance and suitability for bus drivers and transceivers.

Surface Mount: YES

Being surface mountable, this product offers ease of installation, making it convenient for integration into various bus driver and transceiver applications.

No. of Functions: 2

Featuring two functions, this product provides versatility and flexibility in supporting different operation modes, adding value to bus driver and transceiver systems.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for efficient space utilization, contributing to a compact and streamlined design in bus driver and transceiver applications.

No. of Bits: 8

With eight bits, this product offers a wide range of data processing capabilities, enabling efficient handling of complex data streams in bus driver and transceiver operations.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5 V ensures compatibility with common power sources, making this product easy to integrate into existing bus driver and transceiver systems.

Power Supplies (V): 5

By utilizing a 5 V power supply, this product eliminates the need for additional voltage regulation, simplifying the power management aspect of bus driver and transceiver implementations.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options, facilitating easy integration with other components and enhancing its versatility in bus driver and transceiver applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this product enable space-saving installation and reduce the overall footprint in bus driver and transceiver designs.

Propagation Delay (tpd): 4.4 ns

With a propagation delay of 4.4 ns, this product ensures speedy and reliable signal transmission, making it well-suited for high-performance bus driver and transceiver applications.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85°C allows this product to withstand demanding environments, making it a reliable choice for bus driver and transceiver systems deployed in diverse conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics of this product provide the ability to tri-state the device outputs, offering flexibility and control in bus driver and transceiver applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product remains operational in harsh cold environments, ensuring reliable performance for bus driver and transceiver systems in various climates.

Terminal Position: DUAL

Featuring dual terminal positions, this product allows for flexible PCB layout and easy connection to external components, enhancing the convenience and reliability of bus driver and transceiver installations.

No. of Ports: 2

Supporting two ports, this product enables simultaneous data communication between multiple devices, making it a suitable choice for bus driver and transceiver applications requiring connectivity versatility.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm ensures low-profile installation, allowing for compact and space-efficient designs in bus driver and transceiver systems.

Width: 6.1 mm

With a width of 6.1 mm, this product offers a compact form factor, facilitating tight integration and space optimization in bus driver and transceiver applications.

Output Polarity: TRUE

The true output polarity of this product ensures accurate signal transmission and compatibility with various bus driver and transceiver protocols, making it a reliable choice for data communication.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5 V, this product operates efficiently with low power consumption, enhancing energy efficiency and prolonging battery life in bus driver and transceiver systems.

Length: 12.5 mm

The length of 12.5 mm provides a compact footprint, allowing this product to be easily integrated into space-constrained bus driver and transceiver designs.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is designed to withstand extreme temperature ranges, ensuring reliable operation in challenging industrial environments for bus driver and transceiver applications.

Technology: BICMOS

Utilizing BiCMOS technology, this product combines the benefits of both bipolar and CMOS technologies, offering high-speed performance and low power consumption, making it an ideal choice for bus driver and transceiver implementations.

Terminal Form: GULL WING

Featuring a gull wing terminal form, this product allows for reliable soldering and secure electrical connections, ensuring long-term durability and stability in bus driver and transceiver installations.

Packing Method: TUBE

Packaged in tubes, this product provides convenient handling, storage, and transportation, facilitating efficient supply chain management for bus driver and transceiver manufacturers.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product offers precise and tightly-spaced connections, enabling high-density integration and optimized PCB layouts in bus driver and transceiver systems.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V, this product ensures reliable operation even in scenarios with slight voltage fluctuations, providing robustness and stability in bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers 74ABT16373BDGG,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.4 ns

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

74ABT16373BDGG,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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