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2N3924

NXP Semiconductors

2N3924 by NXP Semiconductors

NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .5 A; Qualification: Not Qualified;

Median Price

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Lifecycle Status

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15

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Vyrian

USA . 6,942 parts In-Stock

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Digiode

USA . 5,974 parts In-Stock

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Anansix

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ECAB

Sweden . 88 parts In-Stock

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Halfin

Belgium . 70 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Resion

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GES GmbH

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LWI Electronics Inc

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ICP Electronique

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Fibra_Brandt Electronic GMBH

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LittleDiode

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Lakeland Logistics Inc

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ChromeModa Solutions

Germany . 5,984 parts In-Stock

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IDEA Electronic Components Group

UK . 2,897 parts In-Stock

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DigiPath Technology Company

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MKK Technologies

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One Stop Electronics

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AZTECH Wire

Italy . 886 parts In-Stock

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Native Components

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Northwest PG Solutions

USA . 3,295 parts In-Stock

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Corphita

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UNI Independent Distributors

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Parana Technologies

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Assy Fe

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Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) 2N3924 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

20 pF

Maximum Collector-Emitter Voltage:

18 V

Configuration:

Minimum DC Current Gain (hFE):

10

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-39

JESD-30 Code:

O-MBCY-W3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

7 W

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.75 V

Trade Compliance

2N3924 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

NSN

5961-01-026-1565, 5961010261565, 5961-14-336-1633, 5961143361633

NIIN

010261565, 143361633

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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