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BUK6D43-60EX

Nexperia

BUK6D43-60EX by Nexperia

BUK6D43-60EX by Nexperia is a N-channel power FET with a min DS breakdown voltage of 60V. It is designed for switching applications and has a max pulsed drain current of 52A. This surface mount transistor operates in enhancement mode and has a small outline package style.

Median Price

$0.136

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Rochester

USA . 332,694 parts In-Stock

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Farnell

UK . 332,694 parts In-Stock

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Verical

USA . 327,000 parts In-Stock

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$0.130

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Arrow

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Future Electronics

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$0.560

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Element14

Singapore . 2,390 parts In-Stock

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Nova Conductors

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Flip Electronics

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DigiKey Marketplace

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Bristol Electronics

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Chip Stock

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Vyrian

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NAC Semi

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IBS Electronics

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$0.785

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Sensible Micro Corp

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VNN

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Semicontronic

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$0.069

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AZTECH Wire

Italy . 8,045 parts In-Stock

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Ampacity Inc.

Singapore . 136,096 parts In-Stock

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$0.155

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Argo Parts USA

USA . 420 parts In-Stock

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$0.161

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$0.156

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Netroflash

USA . 1,000 parts In-Stock

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$0.166

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$0.157

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Aztec Data Supply Inc.

USA . 3,562 parts In-Stock

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$1.190

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Continental Prestige Electronics

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RC Electronics

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Perfect Parts

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Lucentia Tech

USA . 13,995 parts In-Stock

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iodParts Technologies Inc.

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Futuretech Components

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Glotronic Ltd.

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Supply Digital

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Microchip USA

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Overview

Discover the BUK6D43-60EX by Nexperia, a high-quality Power Field Effect Transistor (FET) that offers numerous advantages to customers. Manufactured by Nexperia, a trusted leader in the industry, this N-CHANNEL FET is designed with a built-in diode for enhanced performance. Perfect for switching applications, its surface mount design and small outline package make it easy to install and optimize space utilization. With a maximum pulsed drain current of 52A and a minimum DS breakdown voltage of 60V, this transistor delivers outstanding power and reliability. Trust Nexperia's advanced metal-oxide semiconductor technology and silicon element material to provide exceptional performance even in challenging conditions. Experience the benefits of the BUK6D43-60EX today and elevate your electronic projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This sturdy material ensures durability and reliability of the product, making it an ideal choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration offers efficient and enhanced performance, making this power FET suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this power FET convenient and cost-effective.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET provides fast response times and efficient power control.

Surface Mount: YES

The surface mount capability enables easy installation on circuit boards, allowing for compact and space-saving designs.

Minimum DS Breakdown Voltage: 60 V

With a higher breakdown voltage, this power FET can handle greater voltage differentials, making it suitable for various high-voltage applications.

Package Shape: SQUARE

The square package shape allows for efficient use of available space, contributing to compact and optimal circuit board layouts.

Terminal Form: NO LEAD

The no lead terminal form ensures greater reliability and eliminates the risk of lead-related issues, making this power FET a safe and reliable choice.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operating mode enables easy control of the power FET, offering improved efficiency during operation.

Maximum Pulsed Drain Current (IDM): 52 A

With a high maximum pulsed drain current, this power FET can handle high current demands, making it suitable for power-hungry applications.

Avalanche Energy Rating (EAS): 24 mJ

The high avalanche energy rating ensures greater ruggedness and protection against voltage surges or spikes, making this power FET highly resilient.

No. of Terminals: 6

The 6-terminal configuration offers versatility and compatibility with a wide range of circuit designs, making this power FET a flexible choice.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for easy integration into tight spaces, making this power FET suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides improved performance and reliability, making this power FET a superior choice for various applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this power FET can withstand demanding environments, ensuring reliable operation even under extreme conditions.

Transistor Element Material: SILICON

The use of silicon as the transistor element material offers high performance and stability, making this power FET an excellent choice for critical applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this power FET can operate reliably even in harsh and extreme cold environments.

Terminal Finish: TIN

The terminal finish with tin coating ensures excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of this power FET.

Maximum Drain Current (ID): 13 A

With a high maximum drain current, this power FET can handle high power demands, making it suitable for various power-driven applications.

Maximum Drain-Source On Resistance: 0.043 ohm

The low drain-source on resistance minimizes power losses and maximizes efficiency, making this power FET highly efficient in power management.

Terminal Position: DUAL

The dual terminal position provides flexibility and compatibility for circuit board layouts, allowing for convenient integration into diverse electronic systems.

Case Connection: DRAIN

The drain case connection ensures efficient heat dissipation, increasing the product's reliability and prolonging its lifespan.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this power FET can withstand soldering processes, offering ease of assembly and reliability during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and secure connections during assembly, guaranteeing the product's integrity and longevity.

Reference Standard: AEC-Q101; IEC-60134

Complying with AEC-Q101 and IEC-60134 standards provides assurance of quality and reliability, making this power FET a dependable option for critical applications.

Technical Specifications

Power Field Effect Transistors (FET) BUK6D43-60EX attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Nexperia

Specs

Avalanche Energy Rating (EAS):

24 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

52 A

Reference Standard:

AEC-Q101; IEC-60134

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK6D43-60EX Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Nexperia

Founded in 2017, Nexperia is a leading provider of semiconductors, based out of Nijmegen, the Netherlands. It is owned by the partially state-owned Chinese company Wingtech Technology. With factories in Hamburg, Germany and Greater Manchester, England, Nexperia is able to provide its clients with high quality semiconductor products quickly and efficiently.On November 8, 2023, Vishay and Nexperia BV announced that they have entered into an agreement whereby Vishay will acquire Nexperia’s wafer fabrication facility and operations located in Newport, South Wales, U.K. for approximately $177,000 in cash, subject to customary post-closing adjustments. On November 8, 2023, Vishay remitted $8,750 to an escrow account as a deposit for the acquisition. Such amount is included within "Purchase of and deposits for businesses, net of cash acquired" on the consolidated statement of cash flows. To effect the transaction, Vishay will acquire a 100% interest in the legal entity Neptune 6 Limited, and its wholly-owned operating subsidiary, Nexperia Newport Limited, which owns and operates the Newport facility. The closing of the transaction is subject to U.K. government review and customary closing conditions, and is expected to occur in the first quarter of 2024.

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Management team

CEO

Xuezheng Zhang (Wing)

CFO

Stefan Tilger

COO

Achim Kempe

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Hamburg

Fabrication

Fab Initiation

1981

Germany

Hamburg

Wafer Capacity

36,000

1981

36,000

Manchester (8-inch line)

Fabrication

Fab Initiation

2017

Australia

Hazelgrove

Wafer Capacity

12,000

2017

12,000

Manchester (6-inch line)

Fabrication

Fab Initiation

1998

Australia

Hazelgrove

Wafer Capacity

22,000

1998

22,000

Shanghai Fab

Fabrication

Fab Initiation

2022

China

Shanghai

Wafer Capacity

2022

Nexperia Newport

Fabrication

Fab Initiation

1998

UK

Newport

Wafer Capacity

34,000

1998

34,000

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