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BUK6207-55C,118

NXP Semiconductors

BUK6207-55C,118 by NXP Semiconductors

The BUK6207-55 °C,118 from NXP Semiconductors is a powerful N-channel FET designed for high-efficiency applications. It supports a max drain current of 90 A and power dissipation of 158 W, operating up to 175 °C. Ideal for demanding power management tasks in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 130,000 parts In-Stock

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Vyrian

USA . 8,057 parts In-Stock

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Anansix

USA . 2,492 parts In-Stock

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Digiode

USA . 1,131 parts In-Stock

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Northwest PG Solutions

USA . 1,392 parts In-Stock

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$0.299

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$0.264

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Native Components

USA . 457 parts In-Stock

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$0.482

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$0.463

457

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$0.463

AZTECH Wire

Italy . 7,669 parts In-Stock

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$5.430

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$5.430

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Ampacity Inc.

Singapore . 260 parts In-Stock

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$14.050

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One Stop Electronics

USA . 1,254 parts In-Stock

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$63.050

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Perfect Parts

USA . 11,200 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,538 parts In-Stock

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Supply Digital

USA . 2,651 parts In-Stock

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UNI Independent Distributors

Spain . 654 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock unparalleled performance with the BUK6207-55 °C,118 from NXP Semiconductors—a leader in innovative power solutions. This robust N-channel Power FET excels in demanding applications, delivering high efficiency and reliability. With its compact surface-mount design and impressive thermal capabilities, it ensures optimal operation even in challenging environments. Trust NXP for quality and elevate your projects with enhanced power management and lasting durability.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility, which allows for faster operation and better performance, making this product suitable for high-speed applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for flexibility in applications, making it easier to integrate into various electronic devices.

Surface Mount: YES

Surface mount technology improves manufacturing efficiency and allows for compact designs, making this product ideal for space-constrained environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for a high degree of control over the transistor's operation, enhancing efficiency in switching applications.

Maximum Drain Current (Abs) (ID): 90 A

With a maximum drain current of 90 A, this FET can handle high power loads, making it suitable for robust applications like power supplies and motor controls.

Maximum Power Dissipation (Abs): 158 W

A high power dissipation rating of 158 W indicates excellent thermal performance, ensuring reliability and longevity in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and fast switching speeds, enhancing the overall performance of electronic circuits.

Maximum Operating Temperature: 175 °C

Operating at temperatures up to 175 °C allows this FET to function in extreme conditions, making it suitable for automotive and industrial applications.

Terminal Finish: TIN

A tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in electronic assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures compatibility with standard reflow soldering processes, facilitating easy integration in production.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with high-temperature soldering processes, providing flexibility during assembly.

Technical Specifications

Power Field Effect Transistors (FET) BUK6207-55C,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BUK6207-55C,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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