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BUK6208-40C,118

NXP Semiconductors

BUK6208-40C,118 by NXP Semiconductors

The BUK6208-40 °C,118 by NXP Semiconductors is an N-channel power FET designed for high-efficiency applications. It supports a max drain current of 50 A and power dissipation of 128 W, operating up to 175 °C. Ideal for switching and amplification in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,363 parts In-Stock

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Digiode

USA . 2,731 parts In-Stock

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Anansix

USA . 976 parts In-Stock

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Andel Nordic

Denmark . 1,426 parts In-Stock

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$3.260

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$3.130

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AZTECH Wire

Italy . 282 parts In-Stock

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$21.640

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One Stop Electronics

USA . 956 parts In-Stock

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$63.050

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QUARKTWIN TECHNOLOGY LTD

USA . 6,554 parts In-Stock

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UNI Independent Distributors

Spain . 4,933 parts In-Stock

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Northwest PG Solutions

USA . 1,953 parts In-Stock

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Corphita

USA . 1,120 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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$0.494

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$0.457

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Lucentia Tech

USA . 350 parts In-Stock

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$0.494

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Native Components

USA . 81 parts In-Stock

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Overview

Unlock the power of efficiency with the BUK6208-40 °C,118 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a robust N-channel Power FET that excels in demanding applications. With its exceptional performance at high temperatures and impressive current capacity, this versatile component optimizes energy management in various devices, ensuring reliability and longevity. Elevate your projects with NXP’s trusted technology!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are preferred for high-speed switching applications, offering lower on-resistance and higher efficiency.

Configuration: SINGLE

Single configuration allows for simpler circuit design and integration, making it ideal for compact applications.

Surface Mount: YES

Surface mount design helps in saving space on printed circuit boards, enhancing design flexibility and improving performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides better control over conduction, allowing for efficient operation in low-power applications.

Maximum Drain Current (Abs): 50 A

High maximum drain current capacity allows this FET to handle significant loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 128 W

With a high power dissipation rating, this FET can manage larger power without overheating, ensuring reliability in demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology supports faster switching speeds and lower power losses, making it ideal for high-frequency applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows this FET to function reliably in extreme environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) BUK6208-40C,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

50 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

BUK6208-40C,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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