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BUK6211-75C,118

NXP Semiconductors

BUK6211-75C,118 by NXP Semiconductors

The BUK6211-75 °C,118 by NXP Semiconductors is a single N-channel power FET designed for high-efficiency applications. It supports a max drain current of 74 A and power dissipation of 158 W, operating up to 175 °C. Ideal for enhancing performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 79,000 parts In-Stock

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Vyrian

USA . 9,303 parts In-Stock

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Digiode

USA . 3,611 parts In-Stock

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Anansix

USA . 1,944 parts In-Stock

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Northwest PG Solutions

USA . 2,584 parts In-Stock

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$0.138

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$0.121

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Native Components

USA . 361 parts In-Stock

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$0.608

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361

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AZTECH Wire

Italy . 9,303 parts In-Stock

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$4.370

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One Stop Electronics

USA . 1,439 parts In-Stock

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$23.050

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$23.050

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Ampacity Inc.

Singapore . 1,195 parts In-Stock

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$59.050

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UNI Independent Distributors

Spain . 4,434 parts In-Stock

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Corphita

USA . 4,237 parts In-Stock

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Microchip USA

USA . 3,020 parts In-Stock

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Supply Digital

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Overview

Unlock unparalleled performance with the BUK6211-75 °C,118 by NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a powerful N-channel FET designed for efficiency and reliability in demanding applications. With superior thermal management and robust power handling capabilities, this transistor enhances your designs while reducing energy costs. Trust NXP’s expertise to elevate your projects and drive success!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and efficiency in high-speed applications, making them ideal for power management systems.

Configuration: SINGLE

Single configuration simplifies circuit design and helps in compact PCB layouts, ensuring easier integration into a variety of applications.

Surface Mount: YES

Surface mount capability allows for smaller device footprints, enabling high-density assembly and reduced overall system size.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides excellent switching characteristics and improved efficiency, suitable for various applications.

Maximum Drain Current (Abs) (ID): 74 A

With a maximum drain current of 74 A, this FET is capable of handling high load currents, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 158 W

A maximum power dissipation of 158 W ensures that the transistor can handle significant power without overheating, enhancing reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making it a preferred choice for modern electronic devices.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175 °C, this FET is reliable in extreme conditions, suitable for automotive and industrial applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in various environments.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds allows for compatibility with standard soldering processes, ensuring easy assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C provides robustness against thermal stress during assembly, ensuring stable performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) BUK6211-75C,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

74 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BUK6211-75C,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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