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74LVC1G11GXZ

Nexperia

74LVC1G11GXZ by Nexperia

AND GATE; Temperature Grade: AUTOMOTIVE; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR;

Median Price

$0.126

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 170,000 parts In-Stock

1+ parts

-

100+ parts

$0.137

1k+ parts

$0.113

10k+ parts

$0.101

170,000

-

$0.137

$0.113

$0.101

DigiKey

USA . 170,000 parts In-Stock

1+ parts

-

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$0.170

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$0.170

Verical

USA . 170,000 parts In-Stock

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$0.126

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$0.126

Arrow

USA . 19,971 parts In-Stock

1+ parts

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$0.085

19,971

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$0.085

Chip1Stop

Japan . 19,971 parts In-Stock

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-

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$0.078

1k+ parts

$0.073

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19,971

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$0.078

$0.073

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 20,000 parts In-Stock

1+ parts

$0.011

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$0.011

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DigiKey Marketplace

USA . 170,000 parts In-Stock

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Chip Stock

USA . 63,000 parts In-Stock

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Vyrian

USA . 4,047 parts In-Stock

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4,047

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Distributors (Availability)

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AZTECH Wire

Italy . 6,164 parts In-Stock

1+ parts

$0.050

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$0.050

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Native Components

USA . 645 parts In-Stock

1+ parts

$0.411

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$0.394

645

$0.411

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$0.394

Northwest PG Solutions

USA . 1,111 parts In-Stock

1+ parts

$0.452

100+ parts

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$0.398

1,111

$0.452

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$0.398

Microchip USA

USA . 9,592 parts In-Stock

1+ parts

$0.513

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9,592

$0.513

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Corohmni

South Africa . 220 parts In-Stock

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$19.731

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220

$19.731

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$39.239

100+ parts

$35.707

1k+ parts

$32.176

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600

$39.239

$35.707

$32.176

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Supply Digital

USA . 1,146 parts In-Stock

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1,146

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Technical Specifications

Logic Gates 74LVC1G11GXZ attributes and parameters. Explore more Logic Gates devices from Nexperia

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBCC-B6

JESD-609 Code:

e4

Length:

1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

21.5 ns

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.8 mm

Trade Compliance

74LVC1G11GXZ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Nexperia

Founded in 2017, Nexperia is a leading provider of semiconductors, based out of Nijmegen, the Netherlands. It is owned by the partially state-owned Chinese company Wingtech Technology. With factories in Hamburg, Germany and Greater Manchester, England, Nexperia is able to provide its clients with high quality semiconductor products quickly and efficiently.On November 8, 2023, Vishay and Nexperia BV announced that they have entered into an agreement whereby Vishay will acquire Nexperia’s wafer fabrication facility and operations located in Newport, South Wales, U.K. for approximately $177,000 in cash, subject to customary post-closing adjustments. On November 8, 2023, Vishay remitted $8,750 to an escrow account as a deposit for the acquisition. Such amount is included within "Purchase of and deposits for businesses, net of cash acquired" on the consolidated statement of cash flows. To effect the transaction, Vishay will acquire a 100% interest in the legal entity Neptune 6 Limited, and its wholly-owned operating subsidiary, Nexperia Newport Limited, which owns and operates the Newport facility. The closing of the transaction is subject to U.K. government review and customary closing conditions, and is expected to occur in the first quarter of 2024.

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Management team

CEO

Xuezheng Zhang (Wing)

CFO

Stefan Tilger

COO

Achim Kempe

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Hamburg

Fabrication

Fab Initiation

1981

Germany

Hamburg

Wafer Capacity

36,000

1981

36,000

Manchester (8-inch line)

Fabrication

Fab Initiation

2017

Australia

Hazelgrove

Wafer Capacity

12,000

2017

12,000

Manchester (6-inch line)

Fabrication

Fab Initiation

1998

Australia

Hazelgrove

Wafer Capacity

22,000

1998

22,000

Shanghai Fab

Fabrication

Fab Initiation

2022

China

Shanghai

Wafer Capacity

2022

Nexperia Newport

Fabrication

Fab Initiation

1998

UK

Newport

Wafer Capacity

34,000

1998

34,000

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