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LXMS33HCNK-171

Murata Manufacturing

LXMS33HCNK-171 by Murata Manufacturing

LXMS33HCNK-171 by Murata is a telecom IC with a square MICROELECTRONIC ASSEMBLY package. It operates in industrial temperature range (-40 to 85°C) and has a compact size of 3.2mm x 3.2mm x 0.75mm, making it suitable for telecom interface applications requiring surface mount technology.

Median Price

$1.085

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 40,069 parts In-Stock

1+ parts

$1.130

100+ parts

$0.651

1k+ parts

$0.575

10k+ parts

$0.522

40,069

$1.130

$0.651

$0.575

$0.522

DigiKey

USA . 35,622 parts In-Stock

1+ parts

$1.130

100+ parts

$0.650

1k+ parts

$0.589

10k+ parts

$0.537

35,622

$1.130

$0.650

$0.589

$0.537

TTI

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.497

6,000

-

-

-

$0.497

Verical

USA . 5,900 parts In-Stock

1+ parts

-

100+ parts

$1.040

1k+ parts

$0.639

10k+ parts

$0.612

5,900

-

$1.040

$0.639

$0.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 39 parts In-Stock

1+ parts

$8.717

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$8.717

-

-

-

Authorized Procurement Solutions

USA . 17,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,000

-

-

-

-

Continental Prestige Electronics

USA . 5,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,475

-

-

-

-

Argo Parts USA

USA . 1,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,960

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience the superior quality and innovation of Murata Manufacturing with the LXMS33HCNK-171. This cutting-edge product in the category of Other Function Telecom Interface ICs offers unmatched performance and reliability. Designed for industrial-grade applications, this surface mount IC boasts a compact square package shape and a wide operating temperature range. Trust Murata Manufacturing to deliver top-of-the-line telecom circuit solutions that exceed expectations. Upgrade your projects with the LXMS33HCNK-171 and unlock new possibilities today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the product onto a circuit board, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape provides a compact design, making it ideal for applications where space is limited.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures high performance and reliability in telecommunications applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, increasing its versatility for various applications.

Minimum Operating Temperature: -40 °C

The product can function effectively in low-temperature conditions down to -40°C, ensuring reliable operation in a wide range of environments.

Maximum Seated Height: 0.75 mm

The low maximum seated height of 0.75 mm allows for a compact and space-saving design, ideal for applications with height restrictions.

Width: 3.2 mm

The product's width of 3.2 mm provides a small footprint on the circuit board, making it suitable for applications where size is a critical factor.

Length: 3.2 mm

The length of 3.2 mm contributes to the compact design of the product, allowing for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments, making it a durable choice for telecom applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process, reducing the risk of solder joint failure and ensuring a reliable connection.

Telecom IC Type: TELECOM CIRCUIT

Being designed specifically for telecom circuits, this product offers optimized performance and functionality for telecommunications applications.

Technical Specifications

Other Function Telecom Interface ICs LXMS33HCNK-171 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Murata Manufacturing

Specs

JESD-30 Code:

S-XXMA-N

Length:

3.2 mm

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

3.2 mm

Trade Compliance

LXMS33HCNK-171 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Murata Manufacturing

Murata Manufacturing Co., Ltd. is a Japanese electronics manufacturer founded in 1944 by Akira Murata. Through its expansive supply chain network and innovative product portfolio, Murata designs and manufactures a wide variety of electronic components including capacitors, inductor coils, buzzers, sensors and more for applications in the automotive, medical, industrial and consumer sectors. Based in Nagaokakyo City in Kyoto Prefecture of Japan, Murata operates factories around the world with other facilities located throughout Asia Pacific region such as China and Thailand; North America; Europe; Latin America; Middle East & Africa; as well as Oceania.

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Management team

Chairman of the Board

Tsuneo Murata

President

Norio Nakajima

Senior Executive VP, Board Member

Hiroshi Iwatsubo

Manufacturer fab locations 8

Fab name Location Fab Initiation Wafer Capacity

Murata Integrated Passive Solution

Fabrication

Fab Initiation

1989

France

Caen

Wafer Capacity

12,500

1989

12,500

Sendai Fab

Fabrication

Fab Initiation

2008

Japan

Sendai

Wafer Capacity

20,000

2008

20,000

Kanazawa - Fab 2

Fabrication

Fab Initiation

2016

Japan

Hakusan

Wafer Capacity

10,000

2016

10,000

Komoro

Fabrication

Fab Initiation

1980

Japan

Komoro

Wafer Capacity

1980

Yasu Plant

Fabrication

Fab Initiation

1987

Japan

Yasu

Wafer Capacity

14,500

1987

14,500

Kanazawa Plant

Fabrication

Fab Initiation

1985

Japan

Hakusan

Wafer Capacity

5,000

1985

5,000

Vantaa - Fab 1

Fabrication

Fab Initiation

1998

Finland

Vantaa

Wafer Capacity

5,000

1998

5,000

Vantaa - Fab 2

Fabrication

Fab Initiation

2006

Finland

Vantaa

Wafer Capacity

12,000

2006

12,000

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