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LXMS31ACNA-012

Murata Manufacturing

LXMS31ACNA-012 by Murata Manufacturing

Murata Manufacturing's LXMS31ACNA-012 is a telecom IC with 2 terminals in a chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Its compact size of 1.6mm width and 3.2mm length makes it ideal for surface mount installations in telecom circuits.

Median Price

$1.330

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 378 parts In-Stock

1+ parts

$1.330

100+ parts

$0.772

1k+ parts

$0.705

10k+ parts

-

378

$1.330

$0.772

$0.705

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,633

-

-

-

-

Nova Conductors

Japan . 27 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 143 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

143

$0.520

-

-

-

Semicontronic

India . 109 parts In-Stock

1+ parts

$1.130

100+ parts

$1.102

1k+ parts

$1.096

10k+ parts

-

109

$1.130

$1.102

$1.096

-

Argo Parts USA

USA . 1,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,706

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

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-

-

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Continental Prestige Electronics

USA . 885 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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885

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Overview

Elevate your telecom interface systems with the LXMS31ACNA-012 by Murata Manufacturing. Known for their top-notch quality and reliability, Murata Manufacturing delivers yet again with this cutting-edge product. Perfect for a wide range of applications in the telecom industry, this chip carrier package offers unparalleled performance and durability. Experience seamless operation in industrial environments with a temperature range from -40 to 85°C. Upgrade your systems today with the LXMS31ACNA-012 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to heat, making this product suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape provides compact and space-saving design, making it suitable for applications where size is a concern.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces the chances of errors during installation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in challenging industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows this product to function reliably in cold conditions as well.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection and integration into existing systems or circuits.

Maximum Seated Height: 0.7 mm

Low seated height allows for a compact and slim profile, ideal for applications with limited vertical space.

Width: 1.6 mm

Narrow width makes this product suitable for applications where space is limited and a compact design is essential.

Length: 3.2 mm

Short length of the package contributes to a space-efficient design, making it a good choice for compact devices or systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh working environments with varying temperature conditions.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with modern regulations, making this product a sustainable choice.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and compatibility for telecommunication applications.

Technical Specifications

Other Function Telecom Interface ICs LXMS31ACNA-012 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Murata Manufacturing

Specs

JESD-30 Code:

R-PBCC-N2

Length:

3.2 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.7 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

LXMS31ACNA-012 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Murata Manufacturing

Murata Manufacturing Co., Ltd. is a Japanese electronics manufacturer founded in 1944 by Akira Murata. Through its expansive supply chain network and innovative product portfolio, Murata designs and manufactures a wide variety of electronic components including capacitors, inductor coils, buzzers, sensors and more for applications in the automotive, medical, industrial and consumer sectors. Based in Nagaokakyo City in Kyoto Prefecture of Japan, Murata operates factories around the world with other facilities located throughout Asia Pacific region such as China and Thailand; North America; Europe; Latin America; Middle East & Africa; as well as Oceania.

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Management team

Chairman of the Board

Tsuneo Murata

President

Norio Nakajima

Senior Executive VP, Board Member

Hiroshi Iwatsubo

Manufacturer fab locations 8

Fab name Location Fab Initiation Wafer Capacity

Murata Integrated Passive Solution

Fabrication

Fab Initiation

1989

France

Caen

Wafer Capacity

12,500

1989

12,500

Sendai Fab

Fabrication

Fab Initiation

2008

Japan

Sendai

Wafer Capacity

20,000

2008

20,000

Kanazawa - Fab 2

Fabrication

Fab Initiation

2016

Japan

Hakusan

Wafer Capacity

10,000

2016

10,000

Komoro

Fabrication

Fab Initiation

1980

Japan

Komoro

Wafer Capacity

1980

Yasu Plant

Fabrication

Fab Initiation

1987

Japan

Yasu

Wafer Capacity

14,500

1987

14,500

Kanazawa Plant

Fabrication

Fab Initiation

1985

Japan

Hakusan

Wafer Capacity

5,000

1985

5,000

Vantaa - Fab 1

Fabrication

Fab Initiation

1998

Finland

Vantaa

Wafer Capacity

5,000

1998

5,000

Vantaa - Fab 2

Fabrication

Fab Initiation

2006

Finland

Vantaa

Wafer Capacity

12,000

2006

12,000

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