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LXMS31ACNA-010

Murata Manufacturing

LXMS31ACNA-010 by Murata Manufacturing

Murata's LXMS31ACNA-010 is a telecom IC with 2 terminals in a chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Its compact size of 1.6x3.2mm makes it ideal for telecom circuit applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 18,348 parts In-Stock

1+ parts

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18,348

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$19.300

100+ parts

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1k+ parts

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856

$19.300

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Kepictronics

USA . 2,602 parts In-Stock

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2,602

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Continental Prestige Electronics

USA . 2,414 parts In-Stock

1+ parts

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2,414

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Argo Parts USA

USA . 2,259 parts In-Stock

1+ parts

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2,259

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the unmatched quality and reliability of Murata Manufacturing with the LXMS31ACNA-010. As a leading manufacturer in the industry, Murata delivers cutting-edge telecom interface ICs that are essential for various applications. With a focus on providing value to customers, this product offers unrivaled performance, durability, and efficiency. Say goodbye to compromise and experience the benefits of seamless connectivity and enhanced functionality with the LXMS31ACNA-010. Elevate your projects with a trusted partner like Murata Manufacturing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, making it suitable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard mounting solutions and facilitates handling and storage.

No. of Terminals: 2

With only 2 terminals, the product offers simplicity in connection and reduces the risk of errors during installation.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal performance and provides a compact form factor, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in extreme cold environments without compromising functionality.

Terminal Position: BOTTOM

The bottom terminal position enables easy access for soldering or connecting to other components.

Maximum Seated Height: 0.7 mm

The low maximum seated height facilitates compact and space-saving designs in electronic systems.

Width: 1.6 mm

The narrow width of the product supports densely packed layouts and enables efficient use of PCB space.

Length: 3.2 mm

The compact length of the product contributes to overall space optimization in electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in harsh industrial environments.

Terminal Form: NO LEAD

The no lead terminal form complies with environmental regulations and promotes sustainability in product design.

Telecom IC Type: TELECOM CIRCUIT

The telecom circuit type indicates the product's specific functionality for telecommunication applications, ensuring compatibility and performance in such systems.

Technical Specifications

Other Function Telecom Interface ICs LXMS31ACNA-010 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Murata Manufacturing

Specs

JESD-30 Code:

R-PBCC-N2

Length:

3.2 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.7 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

LXMS31ACNA-010 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Murata Manufacturing

Murata Manufacturing Co., Ltd. is a Japanese electronics manufacturer founded in 1944 by Akira Murata. Through its expansive supply chain network and innovative product portfolio, Murata designs and manufactures a wide variety of electronic components including capacitors, inductor coils, buzzers, sensors and more for applications in the automotive, medical, industrial and consumer sectors. Based in Nagaokakyo City in Kyoto Prefecture of Japan, Murata operates factories around the world with other facilities located throughout Asia Pacific region such as China and Thailand; North America; Europe; Latin America; Middle East & Africa; as well as Oceania.

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Management team

Chairman of the Board

Tsuneo Murata

President

Norio Nakajima

Senior Executive VP, Board Member

Hiroshi Iwatsubo

Manufacturer fab locations 8

Fab name Location Fab Initiation Wafer Capacity

Murata Integrated Passive Solution

Fabrication

Fab Initiation

1989

France

Caen

Wafer Capacity

12,500

1989

12,500

Sendai Fab

Fabrication

Fab Initiation

2008

Japan

Sendai

Wafer Capacity

20,000

2008

20,000

Kanazawa - Fab 2

Fabrication

Fab Initiation

2016

Japan

Hakusan

Wafer Capacity

10,000

2016

10,000

Komoro

Fabrication

Fab Initiation

1980

Japan

Komoro

Wafer Capacity

1980

Yasu Plant

Fabrication

Fab Initiation

1987

Japan

Yasu

Wafer Capacity

14,500

1987

14,500

Kanazawa Plant

Fabrication

Fab Initiation

1985

Japan

Hakusan

Wafer Capacity

5,000

1985

5,000

Vantaa - Fab 1

Fabrication

Fab Initiation

1998

Finland

Vantaa

Wafer Capacity

5,000

1998

5,000

Vantaa - Fab 2

Fabrication

Fab Initiation

2006

Finland

Vantaa

Wafer Capacity

12,000

2006

12,000

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