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MT88L70AE1

Microsemi

MT88L70AE1 by Microsemi

MT88L70AE1 by Microsemi is a DTMF signaling circuit with 18 terminals. It operates at temperatures from -40 to 85°C, consuming a max of 5.5mA at 3V. Ideal for telecom applications, this CMOS technology IC is housed in an industrial-grade rectangular package measuring 7.62mm x 22.86mm x 5.33mm.

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AZTECH Wire

Italy . 626 parts In-Stock

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Singapore . 1,086 parts In-Stock

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Argo Parts USA

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Overview

Enhance your telecom signaling systems with the MT88L70AE1 by Microsemi. As a leading manufacturer in the industry, Microsemi delivers top-quality products that guarantee reliability and performance. The MT88L70AE1 is perfect for a wide range of applications in the telecom sector, providing seamless DTMF signaling circuitry. Experience the value and benefits this product brings to your projects, from its industrial-grade temperature tolerance to its low power consumption. Trust Microsemi for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and resistance to environmental factors, making this product a reliable choice for telecom applications.

Power Supplies (V): 3

The standard power supply voltage of 3V ensures compatibility with common power sources, making integration into existing systems straightforward.

No. of Terminals: 18

With 18 terminals, this product offers a range of connection options for flexibility in circuit design and application usage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in various environments and under demanding conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making this product energy-efficient and versatile.

Technical Specifications

Telecom - Signaling ICs MT88L70AE1 attributes and parameters. Explore more Telecom - Signaling ICs devices from Microsemi

Specs

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3

Length:

22.86 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Telecom Signaling Circuits

Maximum Supply Current:

5.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MT88L70AE1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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