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LMC567MDC

Texas Instruments

LMC567MDC by Texas Instruments

Texas Instruments LMC567MDC is a CMOS Tone Decoder Circuit with 5V supply voltage, operating b/w -25°C to 125°C. It comes in an unencased chip package style for surface mount applications. Ideal for telecom signaling ICs, offering upper terminal position and no-lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,971 parts In-Stock

1+ parts

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8,971

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Digiode

USA . 3,018 parts In-Stock

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3,018

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Anansix

USA . 1,860 parts In-Stock

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1,860

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Distributors (Availability)

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Parana Technologies

USA . 1,650 parts In-Stock

1+ parts

$7.013

100+ parts

-

1k+ parts

$7.569

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1,650

$7.013

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$7.569

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AZTECH Wire

Italy . 189 parts In-Stock

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$7.643

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189

$7.643

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DigiPath Technology Company

USA . 1,446 parts In-Stock

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$7.722

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$7.105

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1,446

$7.722

$7.105

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ChromeModa Solutions

Germany . 2,578 parts In-Stock

1+ parts

$7.880

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$6.462

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2,578

$7.880

$6.462

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IDEA Electronic Components Group

UK . 2,124 parts In-Stock

1+ parts

$7.880

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$7.092

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2,124

$7.880

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$7.092

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Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$12.564

100+ parts

$12.439

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$11.936

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800

$12.564

$12.439

$11.936

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One Stop Electronics

USA . 670 parts In-Stock

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$465.000

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670

$465.000

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Corphita

USA . 1,554 parts In-Stock

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1,554

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Overview

Unlock the power of seamless communication with the LMC567MDC by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. The LMC567MDC is a versatile telecom signaling IC that offers exceptional performance in tone decoding circuits. With a wide operating temperature range and surface mount capability, this product is ideal for a variety of applications. Experience superior value and unmatched benefits with the LMC567MDC, the ultimate solution for all your signaling needs.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and facilitating mass production.

Package Style (Meter): UNCASED CHIP

The unencased chip package style provides simplicity and compactness, making it ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this signaling IC can withstand demanding conditions without risking damage or malfunction.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Position: UPPER

The upper terminal position makes it easier to integrate this IC into existing circuit designs, enhancing compatibility and flexibility.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this IC energy-efficient and reliable.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of solder-related issues, ensuring a more robust and durable connection.

Telecom IC Type: TONE DECODER CIRCUIT

As a tone decoder circuit, this IC can accurately decode and interpret different tones or signals, making it suitable for various telecommunication applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic systems, providing compatibility and ease of integration into existing setups.

Technical Specifications

Telecom - Signaling ICs LMC567MDC attributes and parameters. Explore more Telecom - Signaling ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LMC567MDC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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