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LMC567CM

Texas Instruments

LMC567CM by Texas Instruments

LMC567CM by Texas Instruments is a Telecom IC for tone decoding. It operates at -25 to 125 °C with 5V supply voltage. This CMOS technology chip has 8 terminals, GULL WING form, and is surface mountable in a small outline package.

Median Price

$1.030

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Rochester

USA . 85 parts In-Stock

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$1.030

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$0.855

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$0.762

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Digiode

USA . 5,121 parts In-Stock

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DF Sales Co.

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DF Sales Co.

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Vyrian

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Bristol Electronics

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Atlantic Semiconductor

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Fibra_Brandt Electronic GMBH

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ComSIT Distribution GmbH

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Inland Empire Components Inc.

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Electronic Expediters

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Lakeland Logistics Inc

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LWI Electronics Inc

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Manoshevitz Elec. Sales

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Inventory MP

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NAC Semi

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PC Components Company LLC

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Corphita

USA . 4,330 parts In-Stock

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$0.760

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Vigor

Singapore . 1,768 parts In-Stock

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$0.810

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Component Stockers USA

USA . 117 parts In-Stock

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$0.870

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Parana Technologies

USA . 472 parts In-Stock

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$9.633

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DigiPath Technology Company

USA . 775 parts In-Stock

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ChromeModa Solutions

Germany . 4,605 parts In-Stock

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IDEA Electronic Components Group

UK . 2,056 parts In-Stock

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$10.283

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Kepictronics

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GreenTree Electronics

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Alle Elektronik GmbH

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Legend Electronics Inc. (Excess)

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Speed Components Ltd (Excess)

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Computer Components Inc. - USA

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Overview

Unlock the potential of your telecom signaling projects with the LMC567CM from Texas Instruments. Designed with precision and reliability in mind, this tone decoder circuit offers unmatched performance in a compact and easy-to-install package. Whether you're working on telecommunications systems or audio equipment, this product delivers the quality and value you need to take your designs to the next level. Trust Texas Instruments for all your signaling IC needs and experience the difference in performance and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into compact electronic systems, saving valuable space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the PCB, optimizing space utilization in the circuit design.

No. of Terminals: 8

With 8 terminals, this product offers multiple connection points for enhanced signal processing and communication capabilities.

Package Style: SMALL OUTLINE

The small outline package style further contributes to space savings on the PCB, making it ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in a variety of environmental conditions, making it suitable for demanding applications.

Nominal Supply Voltage: 5 V

Designed to operate at a nominal supply voltage of 5 V, this product is compatible with standard power sources commonly used in telecom applications.

Technical Specifications

Telecom - Signaling ICs LMC567CM attributes and parameters. Explore more Telecom - Signaling ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.9 mm

Trade Compliance

LMC567CM Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

NSN

5962-27-010-0912, 5962270100912

NIIN

270100912

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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