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LMC567CM/NOPB

Texas Instruments

LMC567CM/NOPB by Texas Instruments

LMC567CM/NOPB by Texas Instruments is a CMOS Tone Decoder Circuit with 8 terminals. It operates b/w -25°C to 100°C, ideal for telecom signaling applications. This small outline package IC has matte tin finish and gull wing terminal form, suitable for surface mount assembly.

Median Price

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Lifecycle Status

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9

In-Stock Inventory

1k+

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Chip Stock

USA . 10,770 parts In-Stock

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Vyrian

USA . 7,933 parts In-Stock

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Digiode

USA . 1,222 parts In-Stock

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Anansix

USA . 763 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Bristol Electronics

USA . 185 parts In-Stock

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Atlantic Semiconductor

USA . 185 parts In-Stock

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QIE Inc.

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Electronics Depot

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Parana Technologies

USA . 1,123 parts In-Stock

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$6.840

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$7.471

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DigiPath Technology Company

USA . 23 parts In-Stock

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$7.531

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IDEA Electronic Components Group

UK . 711 parts In-Stock

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$7.685

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ChromeModa Solutions

Germany . 59 parts In-Stock

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AZTECH Wire

Italy . 428 parts In-Stock

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Ampacity Inc.

Singapore . 816 parts In-Stock

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One Stop Electronics

USA . 990 parts In-Stock

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Lixinc

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Eliminating Global Boundries, Inc

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Microchip USA

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Overview

Elevate your telecom signaling systems with the LMC567CM/NOPB by Texas Instruments. With a reputation for excellence in manufacturing, this tone decoder circuit offers unmatched quality and reliability. Whether you're in telecommunications, broadcasting, or security, this small outline package delivers precise decoding capabilities with ease. Experience the value of seamless communication and enhanced signal processing with the LMC567CM/NOPB - a game-changer for your industry needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the signaling IC, ensuring reliability in various operating conditions.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into compact electronic devices, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and facilitates efficient circuit board layout and design, making it compatible with standard PCB manufacturing processes.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for versatile signal processing and routing capabilities within the telecom application.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, the signaling IC can reliably function in elevated temperature environments without risk of overheating or performance degradation.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C ensures that the signaling IC can operate effectively in cold conditions, making it suitable for use in various climates and environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and ensures a reliable electrical connection, enhancing the overall performance and longevity of the signaling IC.

Technology: CMOS

The CMOS technology used in the signaling IC offers low power consumption, high speed operation, and compatibility with a wide range of digital systems, making it an efficient and versatile choice for telecom applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common voltage level in many electronic systems, ensuring compatibility and ease of integration with existing circuits and power sources.

Technical Specifications

Telecom - Signaling ICs LMC567CM/NOPB attributes and parameters. Explore more Telecom - Signaling ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

LMC567CM/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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