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MT88L70AS1

Microchip Technology

MT88L70AS1 by Microchip Technology

MT88L70AS1 by Microchip Technology is a Telecom IC for DTMF signaling with 18 terminals. It operates at -40 to 85°C, consuming max 5.5mA at 3V. This small outline package is surface mountable and ideal for telecom signaling applications.

Median Price

$2.083

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 280 parts In-Stock

1+ parts

$1.610

100+ parts

$1.330

1k+ parts

$1.220

10k+ parts

$1.160

280

$1.610

$1.330

$1.220

$1.160

Arrow

USA . 39 parts In-Stock

1+ parts

$2.083

100+ parts

$1.761

1k+ parts

$1.657

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39

$2.083

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$1.657

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Verical

USA . 39 parts In-Stock

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$3.172

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Nova Conductors

Japan . 60 parts In-Stock

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$1.410

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60

$1.410

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Vyrian

USA . 2,738 parts In-Stock

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Electro Sonic

Canada . 1,000 parts In-Stock

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$1.450

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$1.340

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$1.340

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IBS Electronics

USA . 1,000 parts In-Stock

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$1.841

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$1.785

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$1.785

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EMSNET

USA . 497 parts In-Stock

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Euro-Tech

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Ampacity Inc.

Singapore . 2,300 parts In-Stock

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$1.190

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Continental Prestige Electronics

USA . 5,812 parts In-Stock

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$1.380

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$1.320

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Argo Parts USA

USA . 1,084 parts In-Stock

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$1.410

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Marpe Global Electronics

Taiwan . 8,279 parts In-Stock

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Perfect Parts

USA . 7,616 parts In-Stock

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QualityLine Systems

Poland . 7,146 parts In-Stock

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Microchip USA

USA . 2,650 parts In-Stock

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XL Components Corporation

Australia . 2,297 parts In-Stock

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Kepictronics

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Overview

Upgrade your telecom systems with the MT88L70AS1 by Microchip Technology. This high-quality signaling IC provides reliable performance and seamless integration for a wide range of applications. With its small outline package and industrial temperature grade, this DTMF signaling circuit offers unmatched value and benefits to customers looking for efficient and cost-effective solutions. Trust in Microchip Technology's expertise and innovation to enhance your telecommunications experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good protection and durability for the signaling IC, ensuring a longer lifespan and better performance in various conditions.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation of the signaling IC on a circuit board, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easier to integrate the signaling IC into existing circuit designs and layouts, providing flexibility in placement.

Power Supplies (V): 3

Operating at 3 volts, this signaling IC is energy-efficient and suitable for a variety of applications where low power consumption is desired.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this signaling IC can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The signaling IC can operate in low temperatures as low as -40°C, ensuring reliable performance even in harsh environments.

Telecom IC Type: DTMF SIGNALING CIRCUIT

Designed specifically for DTMF signaling, this IC provides accurate and reliable tone generation and detection for telecommunication applications.

Technical Specifications

Telecom - Signaling ICs MT88L70AS1 attributes and parameters. Explore more Telecom - Signaling ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Telecom Signaling Circuits

Maximum Supply Current:

5.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MT88L70AS1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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