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LM567CMX

Texas Instruments

LM567CMX by Texas Instruments

LM567CMX by Texas Instruments is a telecom IC for tone decoding, with 8 terminals in a small outline package. It operates b/w 0-70°C, has a supply voltage of 5V, and peak reflow temperature of 235°C. Ideal for signaling applications in telecommunications due to its compact size and precise tone detection capabilities.

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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DF Sales Co.

USA . 2,084 parts In-Stock

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DF Sales Co.

USA . 2,084 parts In-Stock

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USA . 19,640 parts In-Stock

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Digiode

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Vyrian

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ComSIT Distribution GmbH

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ComSIT USA

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ACDS - Activité Composants Distribution Service

France . 1,063 parts In-Stock

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Anansix

USA . 816 parts In-Stock

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Infinite Electronics LLP

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Nova Conductors

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NexGen Digital

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Distributors (Availability)

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AZTECH Wire

Italy . 492 parts In-Stock

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$9.452

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Parana Technologies

USA . 1,306 parts In-Stock

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$13.887

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$14.368

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DigiPath Technology Company

USA . 802 parts In-Stock

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$15.291

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$14.068

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IDEA Electronic Components Group

UK . 1,662 parts In-Stock

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$15.603

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$14.823

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$14.043

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ChromeModa Solutions

Germany . 1,544 parts In-Stock

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$15.603

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$12.794

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Corohmni

South Africa . 255 parts In-Stock

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Semicontronic

India . 1,324 parts In-Stock

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$355.000

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$346.125

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$344.350

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Ampacity Inc.

Singapore . 985 parts In-Stock

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One Stop Electronics

USA . 618 parts In-Stock

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Lixinc

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Continental Prestige Electronics

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Corphita

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A-Z Elektronik GmbH

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Argo Parts USA

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Alle Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

UK . 850 parts In-Stock

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GreenTree Electronics

Israel . 456 parts In-Stock

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Microchip USA

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Advanced Electronics

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Bastille Electronics

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Overview

Experience seamless communication with the LM567CMX from Texas Instruments, a leading manufacturer known for its top-quality products. This telecom signaling IC offers reliable performance and versatility in various applications. With a compact design and easy surface mounting, it provides convenience while ensuring optimal functionality. Trust Texas Instruments to deliver exceptional value and benefits, making the LM567CMX an essential component for your signaling needs. Elevate your communication systems today with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the signaling IC, making it a reliable choice for telecom applications.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making it suitable for compact telecom devices.

Package Shape: RECTANGULAR

The rectangular shape of the package offers a standardized design for easy integration into telecom systems.

No. of Terminals: 8

With a sufficient number of terminals, this signaling IC can accommodate multiple connections, enhancing its versatility in telecom signaling applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and makes it suitable for portable telecom devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the signaling IC can perform reliably even in harsh telecom environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the signaling IC to function effectively in a wide range of telecom settings.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent conductivity and solderability, ensuring a secure connection in telecom systems.

Technical Specifications

Telecom - Signaling ICs LM567CMX attributes and parameters. Explore more Telecom - Signaling ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.753 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.9 mm

Trade Compliance

LM567CMX Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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