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LM567CN

Texas Instruments

LM567CN by Texas Instruments

LM567CN by Texas Instruments is a tone decoder circuit IC with 8 terminals. Operating b/w 0-70°C, it has a nominal voltage of 5V. Widely used in telecom applications for signaling purposes due to its through-hole terminal form and rectangular package shape.

Median Price

$1.126

Lifecycle Status

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Semicontronic

India . 1 parts In-Stock

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$0.580

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$0.566

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$0.563

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Corphita

USA . 1,684 parts In-Stock

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Component Stockers USA

USA . 152 parts In-Stock

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$2.330

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Singapore . 1 parts In-Stock

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USA . 1,706 parts In-Stock

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$7.980

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$741.040

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$7.182

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DigiPath Technology Company

USA . 419 parts In-Stock

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$8.787

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Germany . 3,487 parts In-Stock

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$7.352

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IDEA Electronic Components Group

UK . 1,913 parts In-Stock

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$8.518

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$8.069

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Corohmni

South Africa . 283 parts In-Stock

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Italy . 317 parts In-Stock

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Overview

Enhance your telecom projects with the LM567CN by Texas Instruments, a top-quality signaling IC designed for tone decoding circuits. With a reliable manufacturer like Texas Instruments, you can trust in the durability and performance of this product. The LM567CN boasts a wide range of applications in telecommunications, offering customers value through its precision, efficiency, and versatility. Upgrade your signaling systems today with the LM567CN and experience the benefits of seamless communication solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a suitable choice for long-term use.

Package Shape: RECTANGULAR

The rectangular shape provides ease of integration and compactness, making it ideal for space-constrained applications.

No. of Terminals: 8

With a sufficient number of terminals, this product offers flexibility in connection options for various circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and maintenance, simplifying the overall setup process.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation in a wide range of temperature environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring stable connections.

Terminal Position: DUAL

The dual terminal position offers increased flexibility in circuit design and layout, accommodating various installation requirements.

Maximum Seated Height: 5.08 mm

The compact maximum seated height allows for efficient use of vertical space, making it suitable for compact designs.

Width: 7.62 mm

The moderate width provides a balance between space efficiency and ease of handling during installation and maintenance.

Length: 9.817 mm

The length of this product ensures compatibility with standard equipment layouts, enabling easy integration into existing systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes this product suitable for standard operating environments, ensuring reliable performance in typical conditions.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and ensures secure connections, making it a convenient choice for circuit integration.

Telecom IC Type: TONE DECODER CIRCUIT

The tone decoder circuit type offers advanced signal processing capabilities, making this product suitable for applications requiring precise tone detection.

Nominal Supply Voltage: 5 V

With a stable 5V nominal supply voltage, this product ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for easy connection with common connectors and PCB layouts, ensuring versatile compatibility in various setups.

Technical Specifications

Telecom - Signaling ICs LM567CN attributes and parameters. Explore more Telecom - Signaling ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.817 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LM567CN Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

NSN

5962-00-250-4441, 5962002504441, 5962-01-455-0774, 5962014550774, 5962-01-333-0230, 5962013330230, 5962-99-774-2220, 5962997742220

NIIN

002504441, 014550774, 013330230, 997742220

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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