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MT8870DS1

Microchip Technology

MT8870DS1 by Microchip Technology

MT8870DS1 by Microchip Tech is a DTMF signaling circuit with 18 terminals. Operates at 5V, max supply current of 9mA. Ideal for telecom applications due to its CMOS technology and industrial temperature grade.

Median Price

$1.642

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Microchip Technology

USA . 7,680 parts In-Stock

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Master Electronics

USA . 1,440 parts In-Stock

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$1.584

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Verical

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Arrow

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Nova Conductors

Japan . 315 parts In-Stock

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$1.690

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Electronics Depot

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Electro Sonic

Canada . 965 parts In-Stock

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Chip Stock

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IBS Electronics

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Vyrian

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Inventory MP

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Bristol Electronics

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Pegasus Components GmbH

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North Shore Components

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Martec Srl

Italy . 48 parts In-Stock

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ComSIT Distribution GmbH

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Semi Source

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LWI Electronics Inc

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Ampacity Inc.

Singapore . 754 parts In-Stock

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$1.330

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Continental Prestige Electronics

USA . 8,647 parts In-Stock

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$1.690

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$1.656

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Argo Parts USA

USA . 6,791 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Semicontronic

India . 856 parts In-Stock

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$2.813

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Corohmni

South Africa . 840 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,582 parts In-Stock

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Microchip USA

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Metaverse IC Inc.

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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RGB Technical Solutions

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Futuretech Components

Singapore . 760 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Overview

Enhance your telecom signaling systems with the MT8870DS1 by Microchip Technology. Known for its superior quality and reliability, Microchip delivers cutting-edge solutions for telecommunications applications. This DTMF signaling circuit offers unmatched value with its efficient power consumption, industrial temperature grade, and small outline package style. With 18 terminals and a nominal supply voltage of 5V, this product ensures seamless integration and optimal performance in various communication networks. Upgrade your signaling ICs today with the MT8870DS1 and experience unparalleled benefits in your telecom operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product in various operating conditions.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Power Supplies (V): 5

Designed to operate efficiently at a standard voltage, ensuring compatibility with different systems.

No. of Terminals: 18

Sufficient terminals for a wide range of signaling functions and connections.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments where reliability is critical.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable signal processing.

Maximum Supply Current: 9 mA

Requires low supply current, making it energy-efficient and cost-effective to operate.

Telecom IC Type: DTMF SIGNALING CIRCUIT

Specifically designed for DTMF signaling, ensuring accurate and efficient communication.

Nominal Supply Voltage: 5 V

Operates at a standard voltage for compatibility with various systems and applications.

Terminal Pitch: 1.27 mm

Provides fine pitch terminals for precise connections and space-saving design.

Technical Specifications

Telecom - Signaling ICs MT8870DS1 attributes and parameters. Explore more Telecom - Signaling ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G18

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Telecom Signaling Circuits

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MT8870DS1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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